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公开(公告)号：US07709744B2
公开(公告)日：2010-05-04
申请号：US11694188
申请日：2007-03-30
申请人： Richard C. Schaefer , Steven Pollock , Charles M. Bailley , Mike Lowe , Andrew J. Balk , John G. Oldendorf
发明人： Richard C. Schaefer , Steven Pollock , Charles M. Bailley , Mike Lowe , Andrew J. Balk , John G. Oldendorf
IPC分类号： H05K1/00
CPC分类号： H05K1/111 , H05K3/341 , H05K2201/09063 , H05K2201/09663 , H05K2201/0969 , H05K2201/10689 , H05K2201/10969 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/49128
摘要： Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.
摘要翻译： 用于表面贴装电路板的部件安装焊盘的通风允许在焊接期间从电气部件及其相关联的安装焊盘之间的接合处逸出气体，并且有助于组件基座和焊盘之间更完整和有效的焊接接头。 排气可以通过板中的一个或多个通孔来实现，以允许不期望的气体逸出到板的下侧，或者通过在衬垫中形成的一个或多个无焊料通道来允许气体逸出 垫的周边。
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公开(公告)号：US20080236871A1
公开(公告)日：2008-10-02
申请号：US11694188
申请日：2007-03-30
申请人： Richard C. Schaefer , Steven Pollock , Charles M. Bailley , Mike Lowe , Andrew J. Balk , John G. Oldendorf
发明人： Richard C. Schaefer , Steven Pollock , Charles M. Bailley , Mike Lowe , Andrew J. Balk , John G. Oldendorf
CPC分类号： H05K1/111 , H05K3/341 , H05K2201/09063 , H05K2201/09663 , H05K2201/0969 , H05K2201/10689 , H05K2201/10969 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/49128
摘要： Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.
摘要翻译： 用于表面贴装电路板的部件安装焊盘的通风允许在焊接期间从电气部件及其相关联的安装焊盘之间的接合处逸出气体，并且有助于组件基座和焊盘之间更完整和有效的焊接接头。 排气可以通过板中的一个或多个通孔来实现，以允许不期望的气体逸出到板的下侧，或者通过在衬垫中形成的一个或多个无焊料通道来允许气体逸出 垫的周边。
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公开(公告)号：US07104803B1
公开(公告)日：2006-09-12
申请号：US11090385
申请日：2005-03-25
CPC分类号： H05K7/1069
摘要： An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.
摘要翻译： 集成电路（IC）封装插座设置有将IC封装连接到电路板的单件式插座触针的阵列。 单件接触销支撑在接触销的中间部分，并且包括两个锐角弯曲部，其允许接触销的两端独立地弹性地接合IC封装的封装焊盘和电路板的接触焊盘 。 接触销进一步成形并布置成在接合期间横向滑动封装焊盘和接触垫，以刮除或穿透任何氧化物或其它污染物积聚。
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4.发明授权Making electrical connections between a circuit board and an integrated circuit 有权在电路板和集成电路之间进行电气连接公开(公告)号：US07241147B2
公开(公告)日：2007-07-10
申请号：US10822572
申请日：2004-04-12
IPC分类号： H01R13/40
CPC分类号： H01R13/2435
摘要： A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.
摘要翻译： 插座可以接收球栅格和平台栅格阵列封装。 因此，在一些实施例中，没有焊球的早期封装原型可以封装在最终用于使用球栅阵列封装的生产设备的相同插座设计中。 在一些实施例中，平台阵列和球栅阵列可以在插座上以自身为中心。 可以使用S形弹簧接触器来以擦拭动作电连接到焊球或焊盘。
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公开(公告)号：US07098534B2
公开(公告)日：2006-08-29
申请号：US10815465
申请日：2004-03-31
CPC分类号： H01L23/62 , H01L2224/16 , H01L2924/15311 , H01L2924/19106 , H05K1/141 , H05K3/3436 , H05K2201/10181 , H05K2201/10204 , H05K2201/2036 , H05K2203/1572 , Y10T29/49105 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149
摘要： A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.
摘要翻译： 一种器件包括衬底。 衬底还包括包括多个焊盘的第一主表面和第二主表面。 至少一个部件附接到第一主表面上的多个焊盘中的至少一些。 至少一个牺牲部件附接到第一主表面。 所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。 第二个高度大于第一个高度。 牺牲部件包括保险丝。
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公开(公告)号：US06926070B2
公开(公告)日：2005-08-09
申请号：US10104526
申请日：2002-03-22
CPC分类号： H01L23/473 , F28D2021/0029 , F28F1/32 , F28F1/34 , F28F21/067 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
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公开(公告)号：US5920460A
公开(公告)日：1999-07-06
申请号：US785761
申请日：1997-01-11
CPC分类号： H05K5/0269 , Y10S439/946
摘要： An electronic circuit module having a metal cover is provided for interconnecting with a host device. The module includes an interface whereby electronic signals can be exchanged between the module and the host device. A mechanism for electrically grounding the metal cover to the ground plane of a printed circuit board housed within the module is provided along with a device for connecting the ground plane of the printed circuit board to a signal reference ground potential supplied by the host device. The present invention includes a module frame for attaching the metal cover thereto. A printed circuit board, including a ground plane, is mounted within the frame. A connector having a plurality of contact elements electrically connected to various the circuits disposed on the printed circuit board, including at least one contact element electrically connected to the ground plane is also adapted to fit within the module frame. The connector includes at least one grounding member. The grounding member forms an electrical connection with one of the contact elements of the connector which is electrically connected to the ground plane of the printed circuit board. With the module fully assembled, the grounding member engages the metal cover, thereby forming a ground path between said cover and the ground plane. The contact element connected to the ground plane of the printed circuit board is positioned within the connector to receive the ground pin of a mating connector located on the host device.
摘要翻译： 提供具有金属盖的电子电路模块，用于与主机设备互连。 该模块包括一个接口，可以在模块和主机设备之间交换电子信号。 将金属盖电连接到容纳在模块内的印刷电路板的接地平面的机构与用于将印刷电路板的接地平面连接到由主机设备提供的信号参考地电位的装置一起提供。 本发明包括用于将金属盖附接到其上的模块框架。 包括接地平面的印刷电路板安装在框架内。 具有电连接到设置在印刷电路板上的各种电路的多个接触元件的连接器包括电连接到接地平面的至少一个接触元件也适于装配在模块框架内。 连接器包括至少一个接地构件。 接地部件与电连接到印刷电路板的接地平面的连接器的接触元件之一形成电连接。 在模块完全组装的情况下，接地构件接合金属盖，从而在所述盖和接地平面之间形成接地路径。 连接到印刷电路板的接地平面的接触元件位于连接器内，以接收位于主机设备上的匹配连接器的接地销。
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