公开(公告)号：US09048157B2

公开(公告)日：2015-06-02

申请号：US13221061

申请日：2011-08-30

申请人： Risako Ueno ,  Hideyuki Funaki ,  Mitsuyoshi Kobayashi

发明人： Risako Ueno ,  Hideyuki Funaki ,  Mitsuyoshi Kobayashi

IPC分类号： H04N3/14 ,  H04N5/225 ,  H01L27/146

CPC分类号： G06T7/0065 ,  G02B3/0037 ,  H01L27/14627 ,  H04N5/23229 ,  H04N9/045 ,  H04N2209/042

摘要： A solid-state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and comprising an imaging region including a plurality of pixel blocks each including a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system comprising a microlens array including a plurality of microlenses each corresponding to one of the pixel blocks, and reducing and re-forming the image to be formed on the imaging plane on the pixel blocks corresponding to the respective microlenses. The imaging plane of the first optical system is located further away from the first optical system than the imaging element when the object is located at an infinite distance.

摘要翻译： 根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括：成像区域，包括多个像素块，每个像素块包括多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及第二光学系统，其包括微透镜阵列，所述微透镜阵列包括多个微透镜，每个微透镜各自对应于所述像素块之一，并且在对应于所述各个微透镜的像素块上减小并重新形成将在所述成像平面上形成的图像。 当物体位于无限距离时，第一光学系统的成像平面位于比成像元件更远离第一光学系统的位置。

公开(公告)号：US08681249B2

公开(公告)日：2014-03-25

申请号：US13221097

申请日：2011-08-30

申请人： Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno

发明人： Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno

IPC分类号： H04N9/64 ,  H04N5/225

CPC分类号： H04N5/232

摘要： A solid-state imaging device according to an embodiment includes: a first optical system configured to form an image of an object on an image formation plane; an imaging element comprising an imaging area which includes a plurality of pixel blocks each including a plurality of pixels; a second optical system configured to include a microlens array including a plurality of microlenses provided to correspond to the plurality of pixel blocks and reduce and re-form an image scheduled to be formed on the image formation plane, in a pixel block corresponding to an individual microlens; and a signal processing unit configured to perform image signal processing with an optical position relation between each microlens and the pixel block corrected, by using an image signal of the object obtained by the imaging element.

摘要翻译： 根据实施例的固态成像装置包括：第一光学系统，被配置为在图像形成平面上形成对象的图像; 成像元件包括：成像区域，其包括多个像素块，每个像素块包括多个像素; 第二光学系统，被配置为包括微透镜阵列，所述微透镜阵列包括多个微透镜，所述微透镜提供为对应于所述多个像素块，并且在对应于个体的像素块中减少并重新形成被调度以形成在所述图像形成平面上的图像 微透镜 以及信号处理单元，被配置为通过使用由所述成像元件获得的所述对象的图像信号，通过校正的每个微透镜与所述像素块之间的光学位置关系来执行图像信号处理。

公开(公告)号：US20130075587A1

公开(公告)日：2013-03-28

申请号：US13416036

申请日：2012-03-09

申请人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/32 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.

摘要翻译： 根据一个实施例，固态成像装置包括具有形成在上表面上的多个像素的传感器基板，形成有多个微透镜的微透镜阵列基板和一端连接到微透镜之间的区域的连接柱 微透镜阵列基板并且另一端结合到上表面。

公开(公告)号：US20120236190A1

公开(公告)日：2012-09-20

申请号：US13419671

申请日：2012-03-14

申请人： Takayuki OGASAHARA ,  Risako Ueno

发明人： Takayuki OGASAHARA ,  Risako Ueno

IPC分类号： H04N9/04 ,  H01L27/146

CPC分类号： H01L27/14627 ,  G02B3/0056 ,  G02B5/201 ,  G02B5/208 ,  H01L27/14621 ,  H01L27/14685 ,  H04N9/045

摘要： According to one embodiment, a solid-state imaging device includes a pixel array and an infrared light eliminating portion. The pixel array has a plurality of pixel cells arranged as being array-shaped. The pixel array detects a signal level of each color light as being shared for each pixel cell. The infrared light eliminating portion eliminates infrared light from light proceeding toward a photoelectric conversion element. The infrared light eliminating portion is arranged for each pixel cell. The infrared light eliminating portion has selection wavelength being set in accordance with color light to be a detection target of the pixel cell.

摘要翻译： 根据一个实施例，固态成像装置包括像素阵列和红外光消除部分。 像素阵列具有排列成数组形状的多个像素单元。 像素阵列检测每个颜色光的信号电平为每个像素单元共享。 红外光消除部消除了向光电转换元件行进的光的红外光。 为每个像素单元设置红外光消除部。 红外光消除部具有根据色光设置的选择波长，作为像素单元的检测对象。

公开(公告)号：US20120062771A1

公开(公告)日：2012-03-15

申请号：US13039504

申请日：2011-03-03

申请人： Risako Ueno ,  Hideyuki Funaki ,  Mitsuyoshi Kobayashi

发明人： Risako Ueno ,  Hideyuki Funaki ,  Mitsuyoshi Kobayashi

IPC分类号： H04N5/335

CPC分类号： H04N13/218 ,  H04N13/232

摘要： In one embodiment, a solid-state imaging device includes: an imaging optical system including: a first and second surfaces facing each other; a flat reflector provided on the first surface and having an aperture in an outer circumferential portion; and a plurality of reflectors provided on the second surface and located in a plurality of ring-like areas, each of the reflectors being inclined in a radial direction, the reflectors having different diameters from one another; and an imaging element module including: an imaging element including an imaging area having a plurality of pixel blocks each including a plurality of pixels, and receiving and converting light from the imaging optical system into image data; a visible light transmission substrate provided between the imaging optical system and the imaging element; a microlens array provided on a surface of the visible light transmission substrate on the imaging element side; and an image processing unit processing the image data obtained by the imaging element.

摘要翻译： 在一个实施例中，固态成像装置包括：成像光学系统，包括：彼此面对的第一和第二表面; 设置在第一表面上并在外圆周部分具有孔的平面反射器; 以及设置在所述第二表面上并且位于多个环状区域中的多个反射器，每个所述反射器在径向方向上倾斜，所述反射器彼此具有不同的直径; 以及成像元件模块，包括：成像元件，包括具有多个像素块的成像区域，每个像素块包括多个像素，并且将来自所述成像光学系统的光接收并转换为图像数据; 设置在所述摄像光学系统和所述摄像元件之间的可见光透射基板; 设置在所述可见光透射基板的所述摄像元件侧的表面上的微透镜阵列; 以及图像处理单元，处理由所述成像元件获得的图像数据。

公开(公告)号：US08716822B2

公开(公告)日：2014-05-06

申请号：US13363801

申请日：2012-02-01

申请人： Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Yoshinori Iida

发明人： Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Yoshinori Iida

IPC分类号： H01L31/0232

CPC分类号： H01L27/1464 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14689

摘要： A solid-state imaging device according to an embodiment includes: a plurality of pixels arranged on a first face of a first semiconductor layer, each of the pixels including a photoelectric conversion element converting light entering through a second face of the first semiconductor layer on the opposite side from the first face into a signal charge, the photoelectric conversion element having a pn junction formed with a first semiconductor region formed on the first face and a second semiconductor region formed on a surface of the first semiconductor region; pixel separating regions separating the pixels from one another and formed between the pixels, each of the pixel separating regions including a second semiconductor layer covering faces in contact with the photoelectric conversion elements, and an insulating film with a lower refractive index than a refractive index of the second semiconductor layer to cover the second semiconductor layer.

摘要翻译： 根据实施例的固态成像装置包括：布置在第一半导体层的第一面上的多个像素，每个像素包括光电转换元件，其转换通过第一半导体层的第二面进入的光 所述光电转换元件具有形成在所述第一面上形成的第一半导体区域的pn结，以及形成在所述第一半导体区域的表面上的第二半导体区域; 像素分离区域，彼此分离并形成在像素之间，每个像素分隔区域包括覆盖与光电转换元件接触的面的第二半导体层，以及折射率低于折射率的绝缘膜 第二半导体层覆盖第二半导体层。

公开(公告)号：US08605160B2

公开(公告)日：2013-12-10

申请号：US13445292

申请日：2012-04-12

申请人： Honam Kwon ,  Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

发明人： Honam Kwon ,  Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

IPC分类号： H04N5/228 ,  G03B17/00

CPC分类号： G03B5/00 ,  G03B2205/0038 ,  H04N5/2328

摘要： According to one embodiment, a camera shake correction device includes a substrate, a fixed part, a linking part, a movable part, a first spring part, a second spring part, a first damper, and a second damper. The fixed part is provided on the substrate and fixed to the substrate. The linking part is provided around the fixed part on the substrate that can move in a first direction within a plane of the substrate with respect to the fixed part. The movable part is provided on the substrate and arranged around the fixed part and the linking part that can move in a second direction that intersects with the first direction within the plane of the substrate.

摘要翻译： 根据一个实施例，相机抖动校正装置包括基底，固定部分，连接部分，可动部分，第一弹簧部分，第二弹簧部分，第一阻尼器和第二阻尼器。 固定部分设置在基板上并固定到基板上。 连接部设置在基板上的固定部分周围，该固定部分能够相对于固定部分在基板的平面内沿第一方向移动。 可移动部分设置在基板上并且布置在固定部分周围并且能够在基板的平面内沿与第一方向相交的第二方向移动的连接部分。

公开(公告)号：US20130248724A1

公开(公告)日：2013-09-26

申请号：US13713523

申请日：2012-12-13

申请人： Go KAWATA ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

发明人： Go KAWATA ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

IPC分类号： G01T1/20

CPC分类号： G01T1/2002 ,  G01N23/046 ,  G01T1/2018 ,  G01T1/248

摘要： A radiation detection apparatus according to an embodiment includes: a scintillator including a fluorescent material to convert radiation to visible radiation photon; a photon detection device array having a plurality of cells each of which includes a photon detection device to detect visible radiation photon emitted from a fluorescent material in the scintillator and convert the visible radiation photon to an electric signal; and a plurality of lenses provided on cells respectively in association with the cells to cause the visible radiation photon to be incident on the photon detection device in an associated cell.

摘要翻译： 根据实施例的放射线检测装置包括：闪烁体，其包括用于将辐射转换成可见光辐射的荧光材料; 具有多个单元的光子检测装置阵列，每个单元包括光子检测装置，用于检测从闪烁体中的荧光材料发射的可见辐射光子，并将可见光辐射光转换成电信号; 以及分别与单元相关联地设置在单元上的多个透镜，以使可见光辐射入射到相关单元中的光子检测装置上。

公开(公告)号：US20130240709A1

公开(公告)日：2013-09-19

申请号：US13713304

申请日：2012-12-13

申请人： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

发明人： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

IPC分类号： H01L27/146

CPC分类号： H01L27/146 ,  H01L27/14605 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645

摘要： A solid-state imaging device according to an embodiment includes: an imaging element including a semiconductor substrate and a plurality of pixel blocks, each of the pixel blocks including at least two of R pixels, G pixels, B pixels, and W pixels; a first optical system configured to form an image of an object on an imaging plane; and a second optical system including a microlens array having a plurality of microlenses provided for the respective pixels blocks, the second optical system being located between the imaging element and the first optical system, the second optical system being configured to reduce and re-image the image formed on the imaging plane onto each of the pixel blocks. A proportion of the W pixels to be provided increases in a direction from a center of each pixel block toward an outer periphery thereof.

摘要翻译： 根据实施例的固态成像装置包括：成像元件，包括半导体衬底和多个像素块，每个像素块包括R像素，G像素，B像素和W像素中的至少两个; 第一光学系统，被配置为在成像平面上形成物体的图像; 以及第二光学系统，其包括具有为各个像素块设置的多个微透镜的微透镜阵列，所述第二光学系统位于所述成像元件和所述第一光学系统之间，所述第二光学系统被配置为减小并重新成像 在成像平面上形成的每个像素块上的图像。 要提供的W像素的比例在从每个像素块的中心朝向其外周的方向上增加。

公开(公告)号：US20110175187A1

公开(公告)日：2011-07-21

申请号：US12875534

申请日：2010-09-03

申请人： Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Yoshinori Iida ,  Tatsuo Shimizu ,  Masamichi Suzuki

发明人： Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Yoshinori Iida ,  Tatsuo Shimizu ,  Masamichi Suzuki

IPC分类号： H01L27/146

CPC分类号： H01L27/1464 ,  H01L27/1462 ,  H01L27/14629

摘要： Certain embodiments provide a solid-state imaging device including: a photoelectric converting unit that includes a semiconductor layer of a second conductivity type provided on a semiconductor substrate of a first conductivity type, converts incident light entering a first surface of the semiconductor substrate into signal charges, and stores the signal charges; a readout circuit that reads the signal charges stored by the photoelectric converting unit; an antireflection structure that is provided on the first surface of the semiconductor substrate to cover the semiconductor layer of the photoelectric converting unit, includes a fixed charge film that retains fixed charges being non-signal charges, and prevents reflection of the incident light; and a hole storage region that is provided between the photoelectric converting unit and the antireflection structure, and stores holes being non-signal charges.

摘要翻译： 某些实施例提供了一种固态成像装置，包括：光电转换单元，其包括设置在第一导电类型的半导体衬底上的第二导电类型的半导体层，将入射到半导体衬底的第一表面的入射光转换为信号电荷 ，并存储信号费用; 读出由光电转换单元存储的信号电荷的读出电路; 设置在半导体衬底的第一表面上以覆盖光电转换单元的半导体层的抗反射结构包括：固定电荷膜，其保持作为非信号电荷的固定电荷，并防止入射光的反射; 以及设置在光电转换单元和抗反射结构之间的孔存储区域，并且存储非信号电荷的空穴。