公开(公告)号：US20130075587A1

公开(公告)日：2013-03-28

申请号：US13416036

申请日：2012-03-09

申请人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/32 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.

摘要翻译： 根据一个实施例，固态成像装置包括具有形成在上表面上的多个像素的传感器基板，形成有多个微透镜的微透镜阵列基板和一端连接到微透镜之间的区域的连接柱 微透镜阵列基板并且另一端结合到上表面。

公开(公告)号：US09040927B2

公开(公告)日：2015-05-26

申请号：US13713523

申请日：2012-12-13

申请人： Go Kawata ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

发明人： Go Kawata ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

IPC分类号： G01T1/20

CPC分类号： G01T1/2002 ,  G01N23/046 ,  G01T1/2018 ,  G01T1/248

摘要： A radiation detection apparatus according to an embodiment includes: a scintillator including a fluorescent material to convert radiation to visible radiation photon; a photon detection device array having a plurality of cells each of which includes a photon detection device to detect visible radiation photon emitted from a fluorescent material in the scintillator and convert the visible radiation photon to an electric signal; and a plurality of lenses provided on cells respectively in association with the cells to cause the visible radiation photon to be incident on the photon detection device in an associated cell.

摘要翻译： 根据实施例的放射线检测装置包括：闪烁体，其包括用于将辐射转换成可见光辐射的荧光材料; 具有多个单元的光子检测装置阵列，每个单元包括光子检测装置，用于检测从闪烁体中的荧光材料发射的可见辐射光子，并将可见光辐射光转换成电信号; 以及分别与单元相关联地设置在单元上的多个透镜，以使可见光辐射入射到相关单元中的光子检测装置上。

公开(公告)号：US08735821B2

公开(公告)日：2014-05-27

申请号：US13428746

申请日：2012-03-23

申请人： Koichi Ishii ,  Kazuhiro Suzuki ,  Hiroto Honda ,  Hideyuki Funaki ,  Risako Ueno ,  Honam Kwon

发明人： Koichi Ishii ,  Kazuhiro Suzuki ,  Hiroto Honda ,  Hideyuki Funaki ,  Risako Ueno ,  Honam Kwon

IPC分类号： G01J5/20 ,  H01L27/146 ,  G01J5/14

CPC分类号： G01J5/14 ,  G01J5/04 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0853 ,  G01J5/10 ,  G01J5/22 ,  H01L27/14649 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： An infrared imaging device, including: connection wiring portions arranged in matrix form on a substrate which is mounted in a package; first and second infrared detecting portions configured to convert intensity of absorbed infrared radiation into respective first and second signals, the second infrared detecting portion being smaller in thermal conductance than the first infrared detecting portion; and a lid member attached to the package so as to define an air-tight gap with the substrate, the connection wiring portions, the first and second infrared detecting portions being accommodated within the gap; wherein a degree-of-vacuum is measured within the gap and a warning issued based on the measured degree-of-vacuum.

摘要翻译： 一种红外成像装置，包括：以矩阵形式布置在安装在包装中的基板上的连接布线部分; 第一红外线检测部和第二红外线检测部，被配置为将吸收的红外辐射的强度转换为相应的第一和第二信号，第二红外线检测部的导热性比第一红外线检测部小。 以及盖构件，其附接到所述封装件以限定与所述基板的气密间隙，所述连接布线部分，所述第一和第二红外检测部分容纳在所述间隙内; 其中在所述间隙内测量真空度，并且基于所测量的真空度发出警告。

公开(公告)号：US08686340B2

公开(公告)日：2014-04-01

申请号：US13361321

申请日：2012-01-30

申请人： Risako Ueno ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

发明人： Risako Ueno ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

IPC分类号： H01L27/00

CPC分类号： H01L27/14623 ,  H01L27/14632 ,  H01L27/14634

摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.

摘要翻译： 根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。 成像基板二维排列有多个像素。 多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。 成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。 遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

公开(公告)号：US08629396B2

公开(公告)日：2014-01-14

申请号：US13235388

申请日：2011-09-18

申请人： Masako Ogata ,  Ikuo Fujiwara ,  Hiroto Honda ,  Kazuhiro Suzuki ,  Honam Kwon ,  Risako Ueno ,  Hitoshi Yagi ,  Masaki Atsuta ,  Koichi Ishii ,  Keita Sasaki ,  Hideyuki Funaki

发明人： Masako Ogata ,  Ikuo Fujiwara ,  Hiroto Honda ,  Kazuhiro Suzuki ,  Honam Kwon ,  Risako Ueno ,  Hitoshi Yagi ,  Masaki Atsuta ,  Koichi Ishii ,  Keita Sasaki ,  Hideyuki Funaki

IPC分类号： H01L27/146

CPC分类号： H01L27/14649 ,  H01L27/14632 ,  H01L27/14687

摘要： An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor.

摘要翻译： 非制冷红外成像元件包括像素区域，器件区域和支撑衬底。 像素区域包括热敏像素。 热敏像素被布置成矩阵并且根据接收到的红外线量来改变其电流 - 电压特性。 器件区域包括驱动电路和包括MOS晶体管的读出电路中的至少一个。 驱动电路驱动热敏像素。 读出电路检测热敏像素的信号。 支撑基板设置有在像素区域下方的空腔区域和MOS晶体管。

公开(公告)号：US20120007205A1

公开(公告)日：2012-01-12

申请号：US12883732

申请日：2010-09-16

申请人： Kazuhiro Suzuki ,  Ikuo Fujiwara ,  Keita Sasaki ,  Honam Kwon ,  Hitoshi Yagi ,  Hiroto Honda ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Ikuo Fujiwara ,  Keita Sasaki ,  Honam Kwon ,  Hitoshi Yagi ,  Hiroto Honda ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno ,  Hideyuki Funaki

IPC分类号： H01L31/101 ,  H01L31/18

CPC分类号： G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  H04N5/33

摘要： Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure.

摘要翻译： 某些实施例提供了一种红外成像装置，包括：SOI结构，其被放置在离基板一定距离处，并且包括：热敏二极管，其检测红外线并将红外线转换成热; 以及将热敏二极管彼此分离的STI区域; 堆叠在SOI结构上的层间绝缘膜; 以及连接到热敏二极管的支撑腿和设置在热敏二极管的外周区域中的垂直信号线。 每个支撑腿包括：将信号传输到垂直信号线的互连单元; 以及层叠绝缘层，夹着所述互连单元，所述层间绝缘层的每个底侧位于比所述SOI结构更高的位置。

公开(公告)号：US08605160B2

公开(公告)日：2013-12-10

申请号：US13445292

申请日：2012-04-12

申请人： Honam Kwon ,  Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

发明人： Honam Kwon ,  Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

IPC分类号： H04N5/228 ,  G03B17/00

CPC分类号： G03B5/00 ,  G03B2205/0038 ,  H04N5/2328

摘要： According to one embodiment, a camera shake correction device includes a substrate, a fixed part, a linking part, a movable part, a first spring part, a second spring part, a first damper, and a second damper. The fixed part is provided on the substrate and fixed to the substrate. The linking part is provided around the fixed part on the substrate that can move in a first direction within a plane of the substrate with respect to the fixed part. The movable part is provided on the substrate and arranged around the fixed part and the linking part that can move in a second direction that intersects with the first direction within the plane of the substrate.

摘要翻译： 根据一个实施例，相机抖动校正装置包括基底，固定部分，连接部分，可动部分，第一弹簧部分，第二弹簧部分，第一阻尼器和第二阻尼器。 固定部分设置在基板上并固定到基板上。 连接部设置在基板上的固定部分周围，该固定部分能够相对于固定部分在基板的平面内沿第一方向移动。 可移动部分设置在基板上并且布置在固定部分周围并且能够在基板的平面内沿与第一方向相交的第二方向移动的连接部分。

公开(公告)号：US20130248724A1

公开(公告)日：2013-09-26

申请号：US13713523

申请日：2012-12-13

申请人： Go KAWATA ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

发明人： Go KAWATA ,  Hideyuki Funaki ,  Honam Kwon ,  Risako Ueno ,  Kazuhiro Suzuki

IPC分类号： G01T1/20

CPC分类号： G01T1/2002 ,  G01N23/046 ,  G01T1/2018 ,  G01T1/248

摘要： A radiation detection apparatus according to an embodiment includes: a scintillator including a fluorescent material to convert radiation to visible radiation photon; a photon detection device array having a plurality of cells each of which includes a photon detection device to detect visible radiation photon emitted from a fluorescent material in the scintillator and convert the visible radiation photon to an electric signal; and a plurality of lenses provided on cells respectively in association with the cells to cause the visible radiation photon to be incident on the photon detection device in an associated cell.

摘要翻译： 根据实施例的放射线检测装置包括：闪烁体，其包括用于将辐射转换成可见光辐射的荧光材料; 具有多个单元的光子检测装置阵列，每个单元包括光子检测装置，用于检测从闪烁体中的荧光材料发射的可见辐射光子，并将可见光辐射光转换成电信号; 以及分别与单元相关联地设置在单元上的多个透镜，以使可见光辐射入射到相关单元中的光子检测装置上。

公开(公告)号：US08742527B2

公开(公告)日：2014-06-03

申请号：US13416290

申请日：2012-03-09

申请人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L21/00 ,  H01L31/0232

CPC分类号： H01L27/14605 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.

摘要翻译： 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

公开(公告)号：US08415622B2

公开(公告)日：2013-04-09

申请号：US13414941

申请日：2012-03-08

申请人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

发明人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

IPC分类号： H01L25/00

CPC分类号： H01L27/14618 ,  G01J5/024 ,  H01L27/1461 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14649 ,  H01L2924/0002 ,  H01L2924/00

摘要： An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit.

摘要翻译： 根据实施例的红外成像元件包括：包括硅第一基板的堆叠结构的半导体基板和第一绝缘膜，在第一基板的表面上设置有第一空腔; 红外线检测单元，设置在所述半导体基板中，并且包括分别设置在所述第一空腔上的检测单元，每个所述检测单元具有二极管和第二绝缘膜，所述第一绝缘膜将入射红外线转换成加热， 由所述第一绝缘膜获得的电信号;第三绝缘膜，其具有与所述第二绝缘膜的顶面相比位于距所述半导体基板更远的距离的顶面; 以及设置在所述第三绝缘膜上的第二基板。 在第二基板和红外线检测单元之间形成第二空腔。