公开(公告)号：US06413381B1

公开(公告)日：2002-07-02

申请号：US09547986

申请日：2000-04-12

申请人： Ken Lee ,  Ke Ling Lee ,  Mingwei Jiang ,  Robert M. Martinson

发明人： Ken Lee ,  Ke Ling Lee ,  Mingwei Jiang ,  Robert M. Martinson

IPC分类号： C23C1434

CPC分类号： C23C14/042 ,  C23C14/56 ,  C23C14/566

摘要： A plasma sputtering system that may be used to deposit a film on a substrate such as an optical disk is disclosed. In one embodiment, the sputtering system includes a main vacuum chamber. A plurality of sputtering chambers and a load lock chamber are connected to the main vacuum chamber. An assembly of a horizontal unprocessed substrate, an inner mask, and an outer mask are pressed onto a substrate transport tray that is positioned in the load lock. The tray supports the substrate and the masks throughout the processing of the substrate. A vertical lift lowers the tray from the load lock onto a carousel. The carousel transports the tray, substrate and masks to the sputtering chambers and then back to the load lock for unloading. Other lifts raise the tray, processed substrate, and masks from the carousel to the sputtering chambers. The tray is selectively pressed against the lower access aperture of the load lock and sputtering chambers so as to isolated them from the main chamber. After processing is complete, the lift pedestal at the load lock raises the tray and the substrate and masks thereon from the carousel to the load lock, whereupon the substrate and masks are removed from the sputtering system.

摘要翻译： 公开了可用于在诸如光盘的基板上沉积膜的等离子体溅射系统。 在一个实施例中，溅射系统包括主真空室。 多个溅射室和负载锁定室连接到主真空室。 将水平未处理的基板，内部掩模和外部掩模的组件压在位于加载锁定中的基板传送托盘上。 托盘在基板的整个加工过程中支撑基板和掩模。 垂直升降机将托盘从装载锁下降到转盘上。 圆盘传送带将托盘，基板和面罩传送到溅射室，然后返回到装载锁卸载。 其他电梯将托盘，加工的基板和掩模从转盘提升到溅射室。 托盘被选择性地压靠在负载锁和溅射室的下进入孔上，以将它们与主室隔离开。 处理完成后，加载锁上的提升基座将托盘和基板从转盘上提升到加载锁上，从而从溅射系统中移除基板和掩模。

公开(公告)号：US06500321B1

公开(公告)日：2002-12-31

申请号：US09519429

申请日：2000-03-02

申请人： Kaihan A. Ashtiani ,  Larry D. Hartsough ,  Richard S. Hill ,  Karl B. Levy ,  Robert M. Martinson

发明人： Kaihan A. Ashtiani ,  Larry D. Hartsough ,  Richard S. Hill ,  Karl B. Levy ,  Robert M. Martinson

IPC分类号： C23C1435

CPC分类号： H01J37/3423 ,  C23C14/3407 ,  H01J37/3405 ,  H01J37/347

摘要： An apparatus and method for controlling and optimizing a non-planar target shape of a sputtering magnetron system are employed to minimize the redeposition of the sputtered material and optimize target erosion. The methodology is based on the integration of sputtered material from each point of the target according to its solid angle view of the rest of the target. The prospective target's geometry is optimized by analytically comparing and evaluating the methodology's results of one target geometry against that of another geometry, or by simply altering the first geometry and recalculating and comparing the results of the first geometry against the altered geometry. The target geometries may be of many different shapes including trapezoidal, cylindrical, parabolic, and elliptical, depending upon the optimum process parameters desired. A sputtering system is developed using this methodology, having a main magnet stack, a rotating magnet, a target having selected target shapes optimized for controlling erosion, downstream magnets, a substrate, and an electric field induced plasma stream.

摘要翻译： 采用用于控制和优化溅射磁控管系统的非平面目标形状的装置和方法来最小化溅射材料的再沉积并优化目标侵蚀。 该方法基于从目标的每个点的溅射材料的整合，根据其目标的其余部分的立体角度视图。 通过分析比较和评估一种目标几何体的结果与另一种几何结构的方法的结果，或简单地改变第一几何并重新计算并比较第一几何的结果与改变的几何结构，来优化预期目标的几何形状。 取决于所需的最佳工艺参数，目标几何形状可以是许多不同的形状，包括梯形，圆柱形，抛物线形和椭圆形。 使用该方法开发溅射系统，其具有主磁体堆叠，旋转磁体，具有针对控制侵蚀优化的所选目标形状的目标，下游磁体，基板和电场感应等离子体流。

公开(公告)号：US06406598B2

公开(公告)日：2002-06-18

申请号：US09866114

申请日：2001-05-25

申请人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

发明人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

IPC分类号： C23C1432

CPC分类号： C23C14/566 ,  C23C14/042

摘要： A plasma sputtering system is described. A substrate handling system thereof places an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask onto a tray in a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks are moved on the tray to a sputtering chamber where the substrate is sputter coated. The substrate handing system removes the processec substrate and accompanying inner and outer masks from the tray in the loadlock to an external substrate change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition.

摘要翻译： 描述了等离子体溅射系统。 其基板处理系统将未处理的基板（例如，光盘），内部掩模和外部掩模放置在溅射系统的负载锁定器的托盘上，然后将进入开口密封到负载锁。 衬底和掩模在托盘上移动到溅射室，其中衬底被溅射涂覆。 基板处理系统将处理基板和伴随的内外掩模从负载锁中的托盘移除到外部基板更换台，其中处理的基板从掩模移除，该基板仍然被基板处理系统夹紧。 另一个未处理的盘被放置在内部掩模上并且在外部掩模内，并且序列重复。 基板处理系统仅与未经受直接溅射沉积的表面上的掩模接触。

公开(公告)号：US06264804B1

公开(公告)日：2001-07-24

申请号：US09547522

申请日：2000-04-12

申请人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

发明人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

IPC分类号： C23C1432

CPC分类号： C23C14/566 ,  C23C14/042

摘要： A substrate handling system auxiliary to a plasma sputtering system is described. The substrate handling system inserts an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask into a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks then are moved to a sputtering chamber where the substrate is coated by sputtering. Subsequently, the substrate handling system moves a processed substrate, and its accompanying inner mask and an outer mask, from the loadlock to an external disk change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Subsequently, another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition, so that the masks can be gripped without causing particulate contamination. A coated surface of the inner mask and outer mask has numerous asperities to trap sputtered material and reduce contamination.

摘要翻译： 描述了辅助于等离子体溅射系统的衬底处理系统。 基板处理系统将未处理的基板（例如，光盘），内部掩模和外部掩模插入到溅射系统的负载锁中，然后将进入开口密封到负载锁。 然后将衬底和掩模移动到通过溅射涂覆衬底的溅射室。 随后，基板处理系统将经处理的基板及其伴随的内掩模和外掩模从负载锁移动到外部盘更换台，其中处理的基板从掩模移除，其仍被基板处理系统夹持 。 随后，将另一个未处理的盘放置在内部掩模上并在外部掩模内，并重复该序列。 基板处理系统仅与未经受直接溅射沉积的表面上的掩模接触，从而可以抓住掩模而不引起颗粒污染。 内罩和外罩的涂覆表面具有许多凹凸以捕获溅射材料并减少污染。