公开(公告)号：US06406598B2

公开(公告)日：2002-06-18

申请号：US09866114

申请日：2001-05-25

申请人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

发明人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

IPC分类号： C23C1432

CPC分类号： C23C14/566 ,  C23C14/042

摘要： A plasma sputtering system is described. A substrate handling system thereof places an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask onto a tray in a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks are moved on the tray to a sputtering chamber where the substrate is sputter coated. The substrate handing system removes the processec substrate and accompanying inner and outer masks from the tray in the loadlock to an external substrate change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition.

摘要翻译： 描述了等离子体溅射系统。 其基板处理系统将未处理的基板（例如，光盘），内部掩模和外部掩模放置在溅射系统的负载锁定器的托盘上，然后将进入开口密封到负载锁。 衬底和掩模在托盘上移动到溅射室，其中衬底被溅射涂覆。 基板处理系统将处理基板和伴随的内外掩模从负载锁中的托盘移除到外部基板更换台，其中处理的基板从掩模移除，该基板仍然被基板处理系统夹紧。 另一个未处理的盘被放置在内部掩模上并且在外部掩模内，并且序列重复。 基板处理系统仅与未经受直接溅射沉积的表面上的掩模接触。

公开(公告)号：US06264804B1

公开(公告)日：2001-07-24

申请号：US09547522

申请日：2000-04-12

申请人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

发明人： Ke Ling Lee ,  Mikhail Mazur ,  Ken Lee ,  Robert M. Martinson

IPC分类号： C23C1432

CPC分类号： C23C14/566 ,  C23C14/042

摘要： A substrate handling system auxiliary to a plasma sputtering system is described. The substrate handling system inserts an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask into a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks then are moved to a sputtering chamber where the substrate is coated by sputtering. Subsequently, the substrate handling system moves a processed substrate, and its accompanying inner mask and an outer mask, from the loadlock to an external disk change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Subsequently, another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition, so that the masks can be gripped without causing particulate contamination. A coated surface of the inner mask and outer mask has numerous asperities to trap sputtered material and reduce contamination.

摘要翻译： 描述了辅助于等离子体溅射系统的衬底处理系统。 基板处理系统将未处理的基板（例如，光盘），内部掩模和外部掩模插入到溅射系统的负载锁中，然后将进入开口密封到负载锁。 然后将衬底和掩模移动到通过溅射涂覆衬底的溅射室。 随后，基板处理系统将经处理的基板及其伴随的内掩模和外掩模从负载锁移动到外部盘更换台，其中处理的基板从掩模移除，其仍被基板处理系统夹持 。 随后，将另一个未处理的盘放置在内部掩模上并在外部掩模内，并重复该序列。 基板处理系统仅与未经受直接溅射沉积的表面上的掩模接触，从而可以抓住掩模而不引起颗粒污染。 内罩和外罩的涂覆表面具有许多凹凸以捕获溅射材料并减少污染。

公开(公告)号：US06413381B1

公开(公告)日：2002-07-02

申请号：US09547986

申请日：2000-04-12

申请人： Ken Lee ,  Ke Ling Lee ,  Mingwei Jiang ,  Robert M. Martinson

发明人： Ken Lee ,  Ke Ling Lee ,  Mingwei Jiang ,  Robert M. Martinson

IPC分类号： C23C1434

CPC分类号： C23C14/042 ,  C23C14/56 ,  C23C14/566

摘要： A plasma sputtering system that may be used to deposit a film on a substrate such as an optical disk is disclosed. In one embodiment, the sputtering system includes a main vacuum chamber. A plurality of sputtering chambers and a load lock chamber are connected to the main vacuum chamber. An assembly of a horizontal unprocessed substrate, an inner mask, and an outer mask are pressed onto a substrate transport tray that is positioned in the load lock. The tray supports the substrate and the masks throughout the processing of the substrate. A vertical lift lowers the tray from the load lock onto a carousel. The carousel transports the tray, substrate and masks to the sputtering chambers and then back to the load lock for unloading. Other lifts raise the tray, processed substrate, and masks from the carousel to the sputtering chambers. The tray is selectively pressed against the lower access aperture of the load lock and sputtering chambers so as to isolated them from the main chamber. After processing is complete, the lift pedestal at the load lock raises the tray and the substrate and masks thereon from the carousel to the load lock, whereupon the substrate and masks are removed from the sputtering system.

摘要翻译： 公开了可用于在诸如光盘的基板上沉积膜的等离子体溅射系统。 在一个实施例中，溅射系统包括主真空室。 多个溅射室和负载锁定室连接到主真空室。 将水平未处理的基板，内部掩模和外部掩模的组件压在位于加载锁定中的基板传送托盘上。 托盘在基板的整个加工过程中支撑基板和掩模。 垂直升降机将托盘从装载锁下降到转盘上。 圆盘传送带将托盘，基板和面罩传送到溅射室，然后返回到装载锁卸载。 其他电梯将托盘，加工的基板和掩模从转盘提升到溅射室。 托盘被选择性地压靠在负载锁和溅射室的下进入孔上，以将它们与主室隔离开。 处理完成后，加载锁上的提升基座将托盘和基板从转盘上提升到加载锁上，从而从溅射系统中移除基板和掩模。

公开(公告)号：US08327878B2

公开(公告)日：2012-12-11

申请号：US12333043

申请日：2008-12-11

申请人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

发明人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

IPC分类号： H01J37/32

CPC分类号： F16K3/0227 ,  F16K51/02 ,  H01J37/32844 ,  H01J2237/166 ,  H01L21/67126 ,  Y02C20/30 ,  Y02P70/605 ,  Y10S277/919 ,  Y10S277/92 ,  Y10T137/8242

摘要： Methods and apparatus for grounding a chamber isolation valve for a processing system are provided. In one embodiment, a grounded chamber isolation valve for a plasma processing system is described. The chamber isolation valve includes a door and a bracing member movably attached to and opposing the door, and at least one electrically conductive member in electrical communication with the door, the at least one electrically conductive member comprising one or more reaction bumpers disposed on the bracing member that are adapted to contact at least one grounded component of the plasma processing system when the door is in the closed position.

摘要翻译： 提供了用于处理系统的室隔离阀接地的方法和装置。 在一个实施例中，描述了用于等离子体处理系统的接地室隔离阀。 腔室隔离阀包括门和可移动地附接到门并与其相对的支撑构件以及与门电连通的至少一个导电构件，所述至少一个导电构件包括设置在支撑件上的一个或多个反应缓冲器 当门处于关闭位置时，适于接触等离子体处理系统的至少一个接地部件的构件。

公开(公告)号：US6015465A

公开(公告)日：2000-01-18

申请号：US57097

申请日：1998-04-08

申请人： Arnold Kholodenko ,  Ke Ling Lee ,  Maya Shendon ,  Efrain Quiles

发明人： Arnold Kholodenko ,  Ke Ling Lee ,  Maya Shendon ,  Efrain Quiles

IPC分类号： H01J37/32 ,  H01L21/00 ,  B05C11/00 ,  C23C16/00

CPC分类号： H01L21/67248 ,  H01J37/321 ,  H01J37/32522 ,  H01L21/67023

摘要： A temperature control system 10 is used to control the temperature of a chamber surface 15, such as a convoluted external surface, of a process chamber 25 that is used to process a semiconductor substrate 30. The temperature control system 10 comprises a vapor chamber 100 that forms an enclosure adjoining or surrounding the process chamber surface 15. A fluid distributor 115 in the vapor chamber 100 applies a fluid film 130 onto the process chamber surface 15. Vaporization of the fluid film 130 from the chamber surface 15 controls the temperature of the chamber surface. Optionally, a vent 165 in the vapor chamber 100 can be used to adjust the vaporization temperature of the fluid in the vapor chamber.

摘要翻译： 温度控制系统10用于控制用于处理半导体衬底30的处理室25的室表面15（例如盘形外表面）的温度。温度控制系统10包括蒸气室100，该蒸气室100 形成邻接或围绕处理室表面15的外壳。蒸气室100中的流体分配器115将流体膜130施加到处理室表面15上。流体膜130从室表面15的蒸发控制室的温度 表面。 可选地，蒸汽室100中的通风口165可用于调节蒸气室中的流体的蒸发温度。

公开(公告)号：US07469715B2

公开(公告)日：2008-12-30

申请号：US11174229

申请日：2005-07-01

申请人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

发明人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

IPC分类号： H01J37/32

CPC分类号： F16K3/0227 ,  F16K51/02 ,  H01J37/32844 ,  H01J2237/166 ,  H01L21/67126 ,  Y02C20/30 ,  Y02P70/605 ,  Y10S277/919 ,  Y10S277/92 ,  Y10T137/8242

摘要： A method and apparatus for grounding a chamber isolation valve are provided. Generally, the method makes use of an electrically conductive elastomeric member or members to effectively ground a chamber isolation valve and/or isolation valve door while avoiding metal-to-metal contact between moving parts in the processing system. In one embodiment, the elastomeric member is attached to and in electrical communication with the door of the chamber isolation valve. The elastomeric member is brought into contact with a grounded component of the plasma processing system when the door is in the closed position. In another embodiment, the conductive elastomeric member is attached to a bracing member of the isolation valve and is brought into contact with a grounded component of the plasma processing system when the bracing member is deployed to hold the isolation valve door in place during substrate processing. Other configurations are also provided.

摘要翻译： 提供了一种用于使室隔离阀接地的方法和装置。 通常，该方法利用导电弹性体构件来有效地将室隔离阀和/或隔离阀门接地，同时避免处理系统中移动部件之间的金属与金属的接触。 在一个实施例中，弹性体构件附接到腔室隔离阀的门并且与腔室隔离阀的门电连通。 当门处于关闭位置时，弹性体构件与等离子体处理系统的接地部件接触。 在另一个实施例中，当支撑构件展开以在衬底处理期间将隔离阀门保持在适当位置时，导电弹性构件附接到隔离阀的支撑构件并与等离子体处理系统的接地构件接触。 还提供其他配置。

公开(公告)号：US07086638B2

公开(公告)日：2006-08-08

申请号：US10844974

申请日：2004-05-12

申请人： Shinichi Kurita ,  Ke Ling Lee ,  Wendell T Blonigan

发明人： Shinichi Kurita ,  Ke Ling Lee ,  Wendell T Blonigan

IPC分类号： F16K51/02

CPC分类号： H01L21/67126 ,  F16K3/188 ,  F16K51/02

摘要： In one embodiment, a slit valve is provided that is adapted to seal an opening and that includes a valve housing having a first wall, a first opening formed in the first wall, a second wall and a second opening formed in the second wall. The slit valve also includes a closure member having a sealing portion adapted to contact the second wall and seal the second opening, and a bracing member moveable relative to the sealing portion and adapted to contact the first wall. The slit valve further includes at least one actuating mechanism adapted to (1) move the sealing portion toward the second wall and into contact with the second wall; and (2) move the bracing member away from the sealing portion and into contact with the first wall so as to brace the sealing portion against the second wall. Numerous other aspects are provided.

公开(公告)号：US08565366B2

公开(公告)日：2013-10-22

申请号：US11783365

申请日：2007-04-09

申请人： Fred Charles Nopwaskey ,  Ke Ling Lee ,  Alfred Wilhelm Dalcher

发明人： Fred Charles Nopwaskey ,  Ke Ling Lee ,  Alfred Wilhelm Dalcher

IPC分类号： G21C9/00

CPC分类号： G21C7/00 ,  B23P6/00 ,  G21C19/02 ,  G21C19/14 ,  G21C19/207 ,  G21Y2002/201 ,  G21Y2004/30 ,  G21Y2004/40 ,  G21Y2004/50 ,  G21Y2004/501 ,  Y10T29/4973 ,  Y10T29/49735

摘要： Method of repairing nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: removing a damaged section of one of the one or more submerged lines; and replacing the damaged section of the one of the one or more submerged lines without welding. Methods of operating nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: shutting down the nuclear reactor; repairing damage to at least one of the one or more submerged lines without welding; and starting up the nuclear reactor. Methods of operating nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: cooling down the nuclear reactor; repairing damage to at least one of the one or more submerged lines without welding; and heating up the nuclear reactor.

摘要翻译： 修理核反应堆的方法包括一个或多个淹没管线焊接在一个或多个支撑托架上的方法可包括：去除一个或多个淹没管线之一的损坏部分; 并且在不焊接的情况下更换一个或多个浸没线中的一个的损坏部分。 操作包括焊接到一个或多个支撑支架的一个或多个淹没线的核反应堆的方法可包括：关闭核反应堆; 在不焊接的情况下对一个或多个浸没线中的至少一个进行修复; 并启动核反应堆。 操作包括焊接到一个或多个支撑支架的一个或多个淹没线的核反应堆的方法可以包括：冷却核反应堆; 在不焊接的情况下对一个或多个浸没线中的至少一个进行修复; 并加热核反应堆。

公开(公告)号：US20090090883A1

公开(公告)日：2009-04-09

申请号：US12333043

申请日：2008-12-11

申请人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

发明人： Ke Ling Lee ,  Shinichi Kurita ,  Emanuel Beer

IPC分类号： F16K25/00

CPC分类号： F16K3/0227 ,  F16K51/02 ,  H01J37/32844 ,  H01J2237/166 ,  H01L21/67126 ,  Y02C20/30 ,  Y02P70/605 ,  Y10S277/919 ,  Y10S277/92 ,  Y10T137/8242

摘要： Embodiments described herein provide a method and apparatus for grounding a chamber isolation valve. In one embodiment, a grounded chamber isolation valve for a plasma processing system is described. The chamber isolation valve includes a door and a bracing member movably attached to and opposing the door, and at least one electrically conductive member in electrical communication with the door, the at least one electrically conductive member comprising one or more reaction bumpers disposed on the bracing member that are adapted to contact at least one grounded component of the plasma processing system when the door is in the closed position.

摘要翻译： 本文描述的实施例提供了用于使腔室隔离阀接地的方法和装置。 在一个实施例中，描述了用于等离子体处理系统的接地室隔离阀。 室隔离阀包括门和可移动地附接到门并与其相对的支撑构件，以及至少一个与门电连通的导电构件，所述至少一个导电构件包括设置在支撑上的一个或多个反应缓冲器 当门处于关闭位置时，适于接触等离子体处理系统的至少一个接地部件的构件。

公开(公告)号：US20080247498A1

公开(公告)日：2008-10-09

申请号：US11783365

申请日：2007-04-09

申请人： Fred Charles Nopwaskey ,  Ke Ling Lee ,  Alfred Wilhelm Dalcher

发明人： Fred Charles Nopwaskey ,  Ke Ling Lee ,  Alfred Wilhelm Dalcher

IPC分类号： G21C7/00

CPC分类号： G21C7/00 ,  B23P6/00 ,  G21C19/02 ,  G21C19/14 ,  G21C19/207 ,  G21Y2002/201 ,  G21Y2004/30 ,  G21Y2004/40 ,  G21Y2004/50 ,  G21Y2004/501 ,  Y10T29/4973 ,  Y10T29/49735

摘要： Method of repairing nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: removing a damaged section of one of the one or more submerged lines; and replacing the damaged section of the one of the one or more submerged lines without welding. Methods of operating nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: shutting down the nuclear reactor; repairing damage to at least one of the one or more submerged lines without welding; and starting up the nuclear reactor. Methods of operating nuclear reactors that include one or more submerged lines welded to one or more support brackets may include: cooling down the nuclear reactor; repairing damage to at least one of the one or more submerged lines without welding; and heating up the nuclear reactor.

摘要翻译： 修理核反应堆的方法包括一个或多个淹没管线焊接在一个或多个支撑托架上的方法可包括：去除一个或多个淹没管线之一的损坏部分; 并且在不焊接的情况下更换一个或多个浸没线中的一个的损坏部分。 操作包括焊接到一个或多个支撑支架的一个或多个淹没线的核反应堆的方法可包括：关闭核反应堆; 在不焊接的情况下对一个或多个浸没线中的至少一个进行修复; 并启动核反应堆。 操作包括焊接到一个或多个支撑支架的一个或多个淹没线的核反应堆的方法可以包括：冷却核反应堆; 在不焊接的情况下对一个或多个浸没线中的至少一个进行修复; 并加热核反应堆。