公开(公告)号：US07911051B2

公开(公告)日：2011-03-22

申请号：US12093332

申请日：2006-10-05

申请人： Robert Ingenbleek ,  Erik Jung ,  Alfred Kolb ,  Andreas Rekofsky ,  Roland Schöllhorn ,  Daniela Wolf

发明人： Robert Ingenbleek ,  Erik Jung ,  Alfred Kolb ,  Andreas Rekofsky ,  Roland Schöllhorn ,  Daniela Wolf

IPC分类号： H01L23/34

CPC分类号： H05K1/021 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/049 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.

摘要翻译： 电子电路装置包括散热器和热耦合到散热器的第一电路载体，平坦地放置在散热器上，并且用于连接电路装置的电子部件。 为至少一个电子部件提供了一种特殊的布置，其与相关部件的相当大的散热能力相关联，此外，还提供了与可能发生的总体和/或线路由的变化相关的进一步的优点 实践。 其重要的因素是组件被布置在保持在第一电路载体中的凹部中的第二电路载体下。 凹槽通过散热器的顶侧。