公开(公告)号：US20130075982A1

公开(公告)日：2013-03-28

申请号：US13702054

申请日：2011-04-11

申请人： Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

发明人： Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

IPC分类号： G01R31/26 ,  H01L21/683

CPC分类号： H01L21/6838 ,  G01R31/2601 ,  G01R31/2865 ,  G01R31/2874 ,  Y10T279/11 ,  Y10T279/34

摘要： A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

摘要翻译： 用于测试集成电路的卡盘包括具有适于支撑被测器件的下表面和上表面的上导电层。 上绝缘层具有与上导电层的下表面至少部分地面对面接触的上表面和下表面。 中间导电层具有至少与上绝缘层的下表面部分地面对面接触的上表面和下表面。

公开(公告)号：US09506973B2

公开(公告)日：2016-11-29

申请号：US13702054

申请日：2011-04-11

申请人： Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

发明人： Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

IPC分类号： G01R31/26 ,  H01L21/683 ,  G01R31/28

CPC分类号： H01L21/6838 ,  G01R31/2601 ,  G01R31/2865 ,  G01R31/2874 ,  Y10T279/11 ,  Y10T279/34

摘要： A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

摘要翻译： 用于测试集成电路的卡盘包括具有适于支撑被测器件的下表面和上表面的上导电层。 上绝缘层具有与上导电层的下表面至少部分地面对面接触的上表面和下表面。 中间导电层具有至少与上绝缘层的下表面部分地面对面接触的上表面和下表面。