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公开(公告)号：US12155189B2
公开(公告)日：2024-11-26
申请号：US17623118
申请日：2020-06-25
Applicant: SAMWON ACT CO., LTD.
Inventor： Kyung Wook Lee , Kyung Yul Lee , Hong Suk Han , Jae Sung Choi
Abstract: The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.
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Patent Agency Ranking
公开(公告)号：US11840844B2
公开(公告)日：2023-12-12
申请号：US17371260
申请日：2021-07-09
Applicant: SAMWON ACT CO., LTD.
Inventor： Kyung Wook Lee , Kyung Yul Lee , Hong Seok Han
IPC: E04F13/08
CPC classification number: E04F13/0833 , E04F13/0885
Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.
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公开(公告)号：US20210102381A1
公开(公告)日：2021-04-08
申请号：US16971134
申请日：2019-02-21
Applicant: SAMWON ACT CO., LTD.
Inventor： Kyung Wook Lee , Kyung Yul Lee , Hong Suk Han
Abstract: The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.
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公开(公告)号：US12006698B2
公开(公告)日：2024-06-11
申请号：US17623140
申请日：2020-06-25
Applicant: SAMWON ACT CO., LTD.
Inventor： Kyung Wook Lee , Kyung Yul Lee , Hong Suk Han , Jae Sung Choi
CPC classification number: E04F13/0866 , B32B3/266 , B32B3/30 , B32B7/12 , E04F13/0833 , B32B2307/3065 , B32B2419/04
Abstract: The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.
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公开(公告)号：US11319711B2
公开(公告)日：2022-05-03
申请号：US16971134
申请日：2019-02-21
Applicant: SAMWON ACT CO., LTD.
Inventor： Kyung Wook Lee , Kyung Yul Lee , Hong Suk Han
Abstract: The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.
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公开(公告)号：US11291123B2
公开(公告)日：2022-03-29
申请号：US16069893
申请日：2017-01-09
Inventor： Kyung Yul Lee , Kyung Wook Lee , Jun Sang Jeong , Yang Seok Lee , Man Kim , Joo Yul Lee , Sang Yeoul Lee
Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
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