Semiconductor device and method of manufacturing the same
    1.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08080855B2

    公开(公告)日:2011-12-20

    申请号:US12407837

    申请日:2009-03-20

    IPC分类号: H01L29/93

    摘要: According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base 16 is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

    摘要翻译: 根据本发明,用于保护透明构件11的保护密封件S1由有机基底16,粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上,并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底16用粘合剂层17和18固定到透明构件11的侧面11b和表面11a。

    Carrier frame for electronic components and production method for electronic components
    3.
    发明授权
    Carrier frame for electronic components and production method for electronic components 有权
    电子元件载体框架及电子零件的生产方法

    公开(公告)号:US07960828B2

    公开(公告)日:2011-06-14

    申请号:US12246021

    申请日:2008-10-06

    IPC分类号: H01L23/34 H01L23/02

    摘要: The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

    摘要翻译: 本发明的载体框架包括基层构件,框架层构件和具有用于存储电子部件的多个开口的定位层构件。 弹性层构件安装在由定位层构件和基层构件之间的框架层构件包围的中空部中。 在弹簧层构件的每个开口处,提供用于将电子部件紧固在定位层构件的相应开口的边缘与小弹簧之间的弹性力的小弹簧与弹簧层构件一体地形成。 在弹簧层部件的长度方向的一端,通过与安装状态的框架部件的内表面接触而沿着长度方向提供弹性力的大弹簧与弹簧层部件一体形成。

    CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR ELECTRONIC COMPONENTS
    4.
    发明申请
    CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR ELECTRONIC COMPONENTS 有权
    电子元件的载体框架和电子元件的生产方法

    公开(公告)号:US20090104014A1

    公开(公告)日:2009-04-23

    申请号:US12246021

    申请日:2008-10-06

    摘要: The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

    摘要翻译: 本发明的载体框架包括基层构件,框架层构件和具有用于存储电子部件的多个开口的定位层构件。 弹性层构件安装在由定位层构件和基层构件之间的框架层构件包围的中空部中。 在弹簧层构件的每个开口处,提供用于将电子部件紧固在定位层构件的相应开口的边缘与小弹簧之间的弹性力的小弹簧与弹簧层构件一体地形成。 在弹簧层部件的长度方向的一端,通过与安装状态的框架部件的内表面接触而沿着长度方向提供弹性力的大弹簧与弹簧层部件一体形成。