公开(公告)号：US08536486B2

公开(公告)日：2013-09-17

申请号：US13113379

申请日：2011-05-23

申请人： Kenji Furuta ,  Satoshi Usuda

发明人： Kenji Furuta ,  Satoshi Usuda

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/03 ,  B23K26/40 ,  B23K2103/50

摘要： A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.

摘要翻译： 通过检测不规则形状部分的位置，沿着分割线将除了检测位置的检测激光束施加到工件的区域上，沿分割线分割包括分割线上的不规则形状部分的工件，以检测 除了所述位置之外，所述工件的表面的高度，在基于检测到的所述表面的高度移动所述加工激光束的聚焦点的同时，将具有在工件内渗透的波长的加工激光束施加和聚焦 工件，除了至少沿着分割线的不规则形状部分的位置之外，在工件的区域中形成改性层，并且向改性层施加外力以沿着分割线分割工件。

公开(公告)号：US20120061361A1

公开(公告)日：2012-03-15

申请号：US13223941

申请日：2011-09-01

申请人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

发明人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

IPC分类号： B23K26/38

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

摘要： A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region on through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

摘要翻译： 分割工件的方法包括：在不形成装置的区域的内部形成预加工变更区域; 通过成像装置通过红外成像检测预加工变更区域的位置，从而将预加工变更区域与计划分割线之间的偏差识别为加工位置校正信息; 并通过利用加工位置校正信息形成主加工变更区域，由此可以将工件沿着规划的分割线精确地划分为单独的装置。

公开(公告)号：US20110290769A1

公开(公告)日：2011-12-01

申请号：US13113379

申请日：2011-05-23

申请人： Kenji FURUTA ,  Satoshi USUDA

发明人： Kenji FURUTA ,  Satoshi USUDA

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/03 ,  B23K26/40 ,  B23K2103/50

摘要： A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.

摘要翻译： 通过检测不规则形状部分的位置，沿着分割线将除了检测位置的检测激光束施加到工件的区域上，沿分割线分割包括分割线上的不规则形状部分的工件，以检测 除了所述位置之外，所述工件的表面的高度，在基于检测到的所述表面的高度移动所述加工激光束的聚焦点的同时，将具有在工件内渗透的波长的加工激光束施加和聚焦 工件，除了至少沿着分割线的不规则形状部分的位置之外，在工件的区域中形成改性层，并且向改性层施加外力以沿着分割线分割工件。

公开(公告)号：US08476553B2

公开(公告)日：2013-07-02

申请号：US13223941

申请日：2011-09-01

申请人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

发明人： Satoshi Usuda ,  Kiyoshi Ohsuga ,  Masaru Nakamura

IPC分类号： B23K26/38

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

摘要： A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

摘要翻译： 分割工件的方法包括：在不形成装置的区域的内部形成预加工变更区域; 通过成像装置通过红外成像来检测预加工变更区域的位置，从而将预加工变更区域与计划分割线之间的偏差识别为加工位置校正信息; 并通过利用加工位置校正信息形成主加工变更区域，由此能够将工件沿着规划的分割线精确地划分成单独的装置。