Epoxy resin composition, method for producing same, and semiconductor device using same
    1.
    发明授权
    Epoxy resin composition, method for producing same, and semiconductor device using same 有权
    环氧树脂组合物及其制造方法以及使用该树脂组合物的半导体装置

    公开(公告)号:US09123689B2

    公开(公告)日:2015-09-01

    申请号:US14004841

    申请日:2012-03-15

    摘要: Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.

    摘要翻译: 公开了一种在固化后具有优异的加工性和优异的耐热性的环氧树脂组合物。 环氧树脂组合物含有具有通过使具有酚羟基的二胺如2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)与四羧酸二酐反应获得的具有特定酰亚胺结构的化合物, 并且其数均分子量为1,000至5,000; 和具有至少两个环氧基的化合物,例如双酚A型环氧树脂。

    EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME
    2.
    发明申请
    EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME 有权
    环氧树脂组合物,其制造方法和使用其的半导体器件

    公开(公告)号:US20140005318A1

    公开(公告)日:2014-01-02

    申请号:US14004841

    申请日:2012-03-15

    IPC分类号: H01L23/373

    摘要: Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.

    摘要翻译: 公开了一种在固化后具有优异的加工性和优异的耐热性的环氧树脂组合物。 环氧树脂组合物含有具有通过使具有酚羟基的二胺如2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)与四羧酸二酐反应获得的具有特定酰亚胺结构的化合物, 并且其数均分子量为1,000至5,000; 和具有至少两个环氧基的化合物,例如双酚A型环氧树脂。