公开(公告)号：US07314543B2

公开(公告)日：2008-01-01

申请号：US10685659

申请日：2003-10-14

申请人： Ming Fang ,  Valery M. Dubin ,  Scott M. Haight

发明人： Ming Fang ,  Valery M. Dubin ,  Scott M. Haight

IPC分类号： C25D5/02 ,  C25D7/12 ,  C25D3/30 ,  C25D3/32

CPC分类号： H01L24/11 ,  C25D3/32 ,  C25D5/02 ,  H01L21/2885 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00

摘要： A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.

摘要翻译： 一种器件包括集成电路和与集成电路的一部分电接触的沉积锡。 沉积的锡通过从浴中电沉积形成。 沉积的锡包括浴的特征残留物。 该浴包括溶于水的锡化合物，强酸和磺基丙基化阴离子表面活性剂。 在另一方面，组合物包括约20至40克/升的亚磺酸甲酯磺酸盐，硫酸亚锡及其混合物之间，约100至200克/升甲磺酸，硫酸和混合物之一 和约1至2克/升一种或多种聚乙二醇烷基-3-磺丙基二醚之间。 另一方面，一种方法包括电镀锡，其电流密度大于约30mA / cm 2，电镀效率大于约95％。