公开(公告)号：US20080180118A1

公开(公告)日：2008-07-31

申请号：US11943105

申请日：2007-11-20

申请人： Seiichirou ITOU ,  Masashi Miyawaki ,  Takeshi Oyamada

发明人： Seiichirou ITOU ,  Masashi Miyawaki ,  Takeshi Oyamada

IPC分类号： G01R31/02 ,  H05K1/03 ,  H05K3/00

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1476 ,  Y10T29/49126

摘要： A method of manufacturing a substrate for a probe card assembly comprises preparing an interconnection layer, preparing a resin layer and preparing a base layer. The method comprises attaching the resin layer to the interconnection layer by a first thermal process at a first temperature. The method comprises attaching the resin layer attached to the interconnection layer to the base layer by a second thermal process at a second temperature higher than the first temperature.

摘要翻译： 制造用于探针卡组件的基板的方法包括制备互连层，制备树脂层和制备基层。 该方法包括在第一温度下通过第一热处理将树脂层附着到互连层。 该方法包括通过在比第一温度高的第二温度的第二热处理将附着到互连层的树脂层附着到基底层。

公开(公告)号：US08378704B2

公开(公告)日：2013-02-19

申请号：US11943105

申请日：2007-11-20

申请人： Seiichirou Itou ,  Masashi Miyawaki ,  Takeshi Oyamada

发明人： Seiichirou Itou ,  Masashi Miyawaki ,  Takeshi Oyamada

IPC分类号： G01R31/00

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1476 ,  Y10T29/49126

摘要： A substrate is provided for a probe card assembly. The substrate includes an interconnection layer including a first surface having a first electrode set and a second surface having a second electrode set electrically connected to the first electrode set. The substrate further includes a base layer including a first surface having a third electrode set electrically connected to the second electrode set and a second surface having a plurality of contact terminals electrically connected to the third electrode set. And the substrate further includes a resin layer including a plurality of sublayers made of different materials. The resin layer is attached to the first surface of the base layer and the second surface of the interconnection layer.

摘要翻译： 为探针卡组件提供基板。 衬底包括互连层，其包括具有第一电极组的第一表面和具有电连接到第一电极组的第二电极组的第二表面。 所述基板还包括基底层，所述基底层包括具有电连接到所述第二电极组的第三电极组的第一表面和具有电连接到所述第三电极组的多个接触端子的第二表面。 并且所述基板还包括包括由不同材料制成的多个子层的树脂层。 树脂层附接到基底层的第一表面和互连层的第二表面。