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公开(公告)号：US08298865B2
公开(公告)日：2012-10-30
申请号：US13357937
申请日：2012-01-25
申请人： Young Berm Jung , Hong Bum Park , Young Geon Kwon , Seong Kwon Chin , Byeung Ho Kim , Seok Koo Jung
发明人： Young Berm Jung , Hong Bum Park , Young Geon Kwon , Seong Kwon Chin , Byeung Ho Kim , Seok Koo Jung
CPC分类号： H01L23/49816 , H01L23/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.
摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。
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2.发明申请SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME 有权用于半导体封装的基板，其制造方法和具有该半导体封装的半导体封装公开(公告)号：US20120118495A1
公开(公告)日：2012-05-17
申请号：US13357937
申请日：2012-01-25
申请人： Young Berm JUNG , Hong Bum PARK , Young Geon KWON , Seong Kwon CHIN , Byeung Ho KIM , Seok Koo JUNG
发明人： Young Berm JUNG , Hong Bum PARK , Young Geon KWON , Seong Kwon CHIN , Byeung Ho KIM , Seok Koo JUNG
IPC分类号： B32B38/10
CPC分类号： H01L23/49816 , H01L23/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.
摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。
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3.发明申请SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME 有权用于半导体封装的基板，其制造方法和具有该半导体封装的半导体封装公开(公告)号：US20090294972A1
公开(公告)日：2009-12-03
申请号：US12471572
申请日：2009-05-26
申请人： Young Berm JUNG , Hong Bum PARK , Young Geon KWON , Seong Kwon CHIN , Byeung Ho KIM , Seok Koo JUNG
发明人： Young Berm JUNG , Hong Bum PARK , Young Geon KWON , Seong Kwon CHIN , Byeung Ho KIM , Seok Koo JUNG
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L23/49816 , H01L23/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.
摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。
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公开(公告)号：US08125086B2
公开(公告)日：2012-02-28
申请号：US12471572
申请日：2009-05-26
申请人： Young Berm Jung , Hong Bum Park , Young Geon Kwon , Seong Kwon Chin , Byeung Ho Kim , Seok Koo Jung
发明人： Young Berm Jung , Hong Bum Park , Young Geon Kwon , Seong Kwon Chin , Byeung Ho Kim , Seok Koo Jung
CPC分类号： H01L23/49816 , H01L23/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.
摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。
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