公开(公告)号：US08125086B2

公开(公告)日：2012-02-28

申请号：US12471572

申请日：2009-05-26

申请人： Young Berm Jung ,  Hong Bum Park ,  Young Geon Kwon ,  Seong Kwon Chin ,  Byeung Ho Kim ,  Seok Koo Jung

发明人： Young Berm Jung ,  Hong Bum Park ,  Young Geon Kwon ,  Seong Kwon Chin ,  Byeung Ho Kim ,  Seok Koo Jung

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.

摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。

公开(公告)号：US08298865B2

公开(公告)日：2012-10-30

申请号：US13357937

申请日：2012-01-25

申请人： Young Berm Jung ,  Hong Bum Park ,  Young Geon Kwon ,  Seong Kwon Chin ,  Byeung Ho Kim ,  Seok Koo Jung

发明人： Young Berm Jung ,  Hong Bum Park ,  Young Geon Kwon ,  Seong Kwon Chin ,  Byeung Ho Kim ,  Seok Koo Jung

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.

摘要翻译： 一种半导体封装用基板的制造方法，其特征在于，具有将具有第一表面和第二表面的第一绝缘层和第二绝缘层附着在第一表面上的导电层的步骤， 使得第一和第二绝缘层的第二表面彼此面对; 通过图案化导电层在第一和第二绝缘层的第一表面上形成第一导电图案; 在包括第一导电图案的第一和第二绝缘层的第一表面上形成焊料掩模以打开第一导电图案的部分; 以及通过除去脱模膜将第一和第二绝缘层彼此分离。

公开(公告)号：US20160086943A1

公开(公告)日：2016-03-24

申请号：US14857135

申请日：2015-09-17

申请人： Sun Young LEE ,  Jae Young Park ,  Han Ki Lee ,  Bon Young Koo ,  Hong Bum Park ,  Young Su Chung ,  Jae Jong Han

发明人： Sun Young LEE ,  Jae Young Park ,  Han Ki Lee ,  Bon Young Koo ,  Hong Bum Park ,  Young Su Chung ,  Jae Jong Han

IPC分类号： H01L27/088 ,  H01L29/423 ,  H01L29/06

CPC分类号： H01L29/42368 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02238 ,  H01L21/02247 ,  H01L21/02252 ,  H01L21/02255 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/3086 ,  H01L29/165 ,  H01L29/66818 ,  H01L29/7848 ,  H01L29/7854

摘要： A semiconductor device includes a substrate, an isolation layer on the substrate, and at least one active fin on the substrate. The isolation layer includes a first surface opposite a second surface. The first surface is contiguous with the substrate. The at least one active fin protrudes from the substrate and includes a first region having a side wall above the second surface of the isolation layer and a second region on the first region. The second region has an upper surface. The first region has a first width contiguous with the second surface of the isolation layer and a second width contiguous with the second region. The second width is 60% or greater than the first width (e.g., 60% to 100%).

摘要翻译： 半导体器件包括衬底，衬底上的隔离层以及衬底上的至少一个活性鳍。 隔离层包括与第二表面相对的第一表面。 第一表面与基底相邻。 所述至少一个活性翅片从所述基底突出并且包括具有位于所述隔离层的第二表面上方的侧壁的第一区域和所述第一区域上的第二区域。 第二区域具有上表面。 第一区域具有与隔离层的第二表面邻接的第一宽度和与第二区域相邻的第二宽度。 第二宽度为第一宽度（例如，60％至100％）的60％或更大。