公开(公告)号：US06958539B2

公开(公告)日：2005-10-25

申请号：US09764207

申请日：2001-01-19

Applicant: Ming-Yi Lay ,  Yong-Fen Hsieh ,  Shang-Kung Tsai ,  Chin-Kun Lo

Inventor： Ming-Yi Lay ,  Yong-Fen Hsieh ,  Shang-Kung Tsai ,  Chin-Kun Lo

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/32 ,  H01L29/41

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/11902 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2203/0597 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.

Abstract translation: 提供用于连接不导电基板和不具有侧向短路的芯片的金属凸块。 在第一优选实施例中，绝缘层覆盖所有金属凸块的整个侧壁。 在第二优选实施例中，第一金属凸块和第二金属凸块的预定部分被绝缘层覆盖。 例如，第一金属凸块的侧壁的第一预定部分可以被绝缘层覆盖，而第二侧壁的侧壁的第二预定部分也被绝缘层覆盖。

公开(公告)号：US07041589B2

公开(公告)日：2006-05-09

申请号：US10656248

申请日：2003-09-08

Applicant: Ming-Yi Lay ,  Yong-Fen Hsieh ,  Shang-Kung Tsai ,  Chin-Kun Lo

Inventor： Ming-Yi Lay ,  Yong-Fen Hsieh ,  Shang-Kung Tsai ,  Chin-Kun Lo

IPC: H01L21/4763

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/11902 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2203/0597 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.

公开(公告)号：US07525628B2

公开(公告)日：2009-04-28

申请号：US11826447

申请日：2007-07-16

Applicant: Chia-Jung Wu ,  Wen-Hui Peng ,  Che-Chih Chang ,  Shang-Kung Tsai ,  Yu-Meng Kao ,  Chih-Hao Chang

Inventor： Chia-Jung Wu ,  Wen-Hui Peng ,  Che-Chih Chang ,  Shang-Kung Tsai ,  Yu-Meng Kao ,  Chih-Hao Chang

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2001/133612 ,  H05K1/118 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/09081

Abstract: A display module includes components of a display panel having an outward first FPC for connecting to a system, wherein the first FPC has a foldable part on which a welding area is defined, and a backlight unit opposite to the display panel for providing illumination for the display panel. The backlight unit has an outward second FPC which is welded with the welding area of the foldable part. Both the foldable part and second FPC are folded and turned around to keep the welding area attach to the backside of the backlight unit.

Abstract translation: 显示模块包括具有用于连接到系统的外部第一FPC的显示面板的部件，其中第一FPC具有限定焊接区域的可折叠部分，以及与显示面板相对的背光单元，用于为 显示面板。 背光单元具有与可折叠部分的焊接区域焊接的向外的第二FPC。 可折叠部分和第二FPC都被折叠并转动以保持焊接区域附着到背光单元的背面。