公开(公告)号：US07144471B2

公开(公告)日：2006-12-05

申请号：US10068400

申请日：2002-02-06

申请人： Shigetaka Kobayashi ,  Takeshi Yamada ,  Masaki Hanada

发明人： Shigetaka Kobayashi ,  Takeshi Yamada ,  Masaki Hanada

IPC分类号： B29C65/00 ,  B32B37/00 ,  G01F1/13

CPC分类号： B29C66/472 ,  B29C43/36 ,  B29C65/1406 ,  B29C65/1409 ,  B29C65/1416 ,  B29C65/1425 ,  B29C65/1435 ,  B29C65/148 ,  B29C65/1496 ,  B29C65/4835 ,  B29C66/0242 ,  B29C66/1122 ,  B29C66/3474 ,  B29C66/348 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/7394 ,  B29C66/8322 ,  B29C66/91212 ,  B29C66/91231 ,  B29C66/91411 ,  B29C66/91421 ,  B29C66/91645 ,  B29C66/961 ,  B29C2035/0822 ,  B29C2043/522 ,  B29K2995/0027 ,  H01L21/67115 ,  H01L21/67144 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/323 ,  H05K3/3494 ,  H01L2924/00 ,  B29K2309/08 ,  B29K2083/00 ,  H01L2224/0401

摘要： A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.

公开(公告)号：US06515498B1

公开(公告)日：2003-02-04

申请号：US09479940

申请日：2000-01-10

申请人： Shigetaka Kobayashi ,  Toshiyuki Eba ,  Takanori Tahara ,  Kenji Sato ,  Hiromitsu Wada

发明人： Shigetaka Kobayashi ,  Toshiyuki Eba ,  Takanori Tahara ,  Kenji Sato ,  Hiromitsu Wada

IPC分类号： G01R3102

CPC分类号： G01R31/2886

摘要： An apparatus 10 for pressing a prober according to the present invention, which can press a prober 6 on an electrode-forming portion 4 of an inspection substrate 3 at a sufficient pressure by pivoting four split pressure heads 13 separately by a cylinder 16, and ensure an intimate contact between the prober 6 and the elestrode-forming portion 4 of the inspection substrate 3.

摘要翻译： 根据本发明的用于按压检测器的装置10，其可以通过由圆筒16分开地枢转四个分离压头13，以足够的压力将探测器6按压在检查基板3的电极形成部分4上，并且确保 探测器6与检查基板3的蚀刻形成部分4之间的紧密接触。

公开(公告)号：US4974238A

公开(公告)日：1990-11-27

申请号：US295327

申请日：1989-01-10

申请人： Shigetaka Kobayashi ,  Yuuichi Shibata ,  Shuuhei Tanaka

发明人： Shigetaka Kobayashi ,  Yuuichi Shibata ,  Shuuhei Tanaka

IPC分类号： G03G15/00 ,  G03G21/00 ,  G03G21/02 ,  G03G21/16

CPC分类号： G03G15/553 ,  G03G15/55 ,  G03G15/751 ,  G03G2221/1663 ,  G03G2221/18 ,  G03G2221/1838

摘要： Equipment using consumables that require replacement after a predetermined number of uses includes counter arrangements for keeping track of the number of uses of each consumable. Even though some of the consumables may replace the same item, the usage count is maintained for each individual consumable. For the consumables, automatic identification of replaced items is provided whereby the counter arrangement is enabled to accumulate usage counts on the correct consumables.

公开(公告)号：US06791682B2

公开(公告)日：2004-09-14

申请号：US09683701

申请日：2002-02-05

申请人： Shigetaka Kobayashi

发明人： Shigetaka Kobayashi

IPC分类号： G01N21896

CPC分类号： G01N21/8806 ,  G01N21/95

摘要： A lighting inspection apparatus is provided which uses a small backlight comprised of a dimmer plate and a xenon lamp or a fluorescent lamp that miniaturizes the inspection apparatus for a display panel. An inspection method is described for a display panel, which uses a dimmer plate autonomously adjusting light. The apparatus for inspecting a display panel includes: a support structure disposing thereon a display panel to be inspected; a light source; and a dimmer plate with a characteristic modulating a light transmission characteristic in accordance with an intensity of light incident thereonto, the dimmer plate being disposed between the support structure and the light source, wherein light emitted from the light source is made to transmit through the dimmer plate, then made incident onto the display panel disposed on the support structure.

摘要翻译： 提供一种照明检查装置，其使用由调光板和氙灯或荧光灯组成的小型背光，使得显示面板的检查装置小型化。 描述了一种显示面板的检查方法，该显示面板使用调光板自主调节光。 用于检查显示面板的装置包括：在其上设置待检查的显示面板的支撑结构; 光源; 以及具有根据入射到其上的光强度调制透光特性的调光板，所述调光板设置在所述支撑结构和所述光源之间，其中使从所述光源发射的光透过所述调光器 然后使其入射到设置在支撑结构上的显示面板上。

公开(公告)号：US06275056B1

公开(公告)日：2001-08-14

申请号：US09027640

申请日：1998-02-23

申请人： Shigetaka Kobayashi

发明人： Shigetaka Kobayashi

IPC分类号： G01R144

CPC分类号： G01R1/07314 ,  G01R1/06744 ,  G01R1/06761 ,  G01R31/2886

摘要： A prober device is disclosed herein for making and maintaining a plurality of discrete electrical connections with an object having a plurality of conductive pads. The prober device includes an insulating substrate having a linear expansion coefficient that is less than or equal to about five times a linear expansion coefficient of the test object and a plurality of conductive probes attached thereto and having a pitch l that is substantially the same as or slightly smaller than a pitch l′ of the conductive pads. When mating the prober device to the object, the prober device is heated to compensate for a difference in the pitches of the conductive pads and of the probes. Correct positioning is permitted as a result of the difference between the linear expansion coefficients of the prober device and the test object.

摘要翻译： 本文公开了一种探针装置，用于制造和维持具有多个导电垫的物体的多个分立的电连接。 探针装置包括绝缘基板，其线性膨胀系数小于或等于测试对象的线性膨胀系数的大约五倍，以及附接到其上的多个导电探针，并且具有与之基本相同的间距l 略小于导电垫的间距l'。 当将探测器装置与对象相配合时，探测器件被加热以补偿导电焊盘和探针间距的差异。 由于探测器设备和测试对象的线性扩展系数之间的差异，允许进行正确的定位。