Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
    3.
    发明申请
    Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same 审中-公开
    树脂组合物,以及使用其制备的预浸料和印刷电路板

    公开(公告)号:US20120097437A1

    公开(公告)日:2012-04-26

    申请号:US13006530

    申请日:2011-01-14

    IPC分类号: H05K1/03 C08K3/34 C08L63/00

    摘要: A resin composition is provided. The resin composition comprises: an epoxy resin; a polymer solution as a hardener, which is prepared by the following steps: (a) dissolving an N,O-heterocyclic compound into a first solvent to form a first reaction solution, wherein the N,O-heterocyclic compound is of Formula I or Formula II: wherein, R1 to R3, W1, W2, m, n, p and q are defined in the specification; (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization; and (c) cooling the first reaction solution to a second temperature to substantially terminate the ring-opening polymerization, and thus obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature, and wherein, the amount of the hardener, based on the solid, is about 20 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin.

    摘要翻译: 提供树脂组合物。 树脂组合物包含:环氧树脂; 作为硬化剂的聚合物溶液,其通过以下步骤制备:(a)将N,O-杂环化合物溶解在第一溶剂中以形成第一反应溶液,其中所述N,O-杂环化合物为式I或 式II:其中,R1至R3,W1,W2,m,n,p和q在说明书中定义; (b)将第一反应溶液加热至第一温度以进行开环聚合; 和(c)将第一反应溶液冷却至第二温度以基本上终止开环聚合,从而获得聚合物溶液,其中第一溶剂对N,O-杂环化合物不反应; 第一温度高于N,O-杂环化合物的软化温度,低于第一溶剂的沸点; 并且第二温度低于第一温度,并且其中,基于固体的固化剂的量为每100重量份环氧树脂约20重量份至约200重量份。