公开(公告)号：US20090166828A1

公开(公告)日：2009-07-02

申请号：US11966303

申请日：2007-12-28

Applicant: Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

Inventor： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract translation: 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。

公开(公告)号：US08659133B2

公开(公告)日：2014-02-25

申请号：US13220354

申请日：2011-08-29

Applicant: Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

Inventor： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC: H01L23/48 ,  H01L29/66

CPC classification number: H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract translation: 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。

公开(公告)号：US08008132B2

公开(公告)日：2011-08-30

申请号：US11966303

申请日：2007-12-28

Applicant: Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

Inventor： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC: H01L21/00

CPC classification number: H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract translation: 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。

公开(公告)号：US20110309485A1

公开(公告)日：2011-12-22

申请号：US13220354

申请日：2011-08-29

Applicant: Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

Inventor： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract translation: 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。