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公开(公告)号:US07854829B2
公开(公告)日:2010-12-21
申请号:US11812175
申请日:2007-06-15
申请人: Akifumi Kamijima , Atsushi Yamaguchi , Masahiro Saito , Shingo Miyata , Yuji Otsubo , Souhei Horiuchi
发明人: Akifumi Kamijima , Atsushi Yamaguchi , Masahiro Saito , Shingo Miyata , Yuji Otsubo , Souhei Horiuchi
IPC分类号: C25D5/02
CPC分类号: H05K3/243 , C25D5/022 , C25D5/10 , H05K3/241 , H05K2203/0574
摘要: A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.
摘要翻译: 提供一种电镀方法,其允许多层的电镀图案的组合均匀而没有任何操作复杂性。 包含电镀图案的电沉积镀层的面积在多个层中是恒定的。 因此,电镀电流密度的值容易保持恒定,无需特别的操作。 因此,多个层中的每个层中的电镀图案容易形成为具有均匀的组成。
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公开(公告)号:US20080006537A1
公开(公告)日:2008-01-10
申请号:US11812175
申请日:2007-06-15
申请人: Akifumi Kamijima , Atsushi Yamaguchi , Masahiro Saito , Shingo Miyata , Yuji Otsubo , Souhei Horiuchi
发明人: Akifumi Kamijima , Atsushi Yamaguchi , Masahiro Saito , Shingo Miyata , Yuji Otsubo , Souhei Horiuchi
IPC分类号: C25D5/10
CPC分类号: H05K3/243 , C25D5/022 , C25D5/10 , H05K3/241 , H05K2203/0574
摘要: A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.
摘要翻译: 提供一种电镀方法,其允许多层的电镀图案的组合均匀而没有任何操作复杂性。 包含电镀图案的电沉积镀层的面积在多个层中是恒定的。 因此,电镀电流密度的值容易保持恒定,无需特别的操作。 因此,多个层中的每个层中的电镀图案容易形成为具有均匀的组成。
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