公开(公告)号：US06521485B2

公开(公告)日：2003-02-18

申请号：US09760763

申请日：2001-01-17

申请人： Spencer Su ,  James Lai ,  Lin Chien-Tsun ,  Captain Chen ,  Allen Chen ,  C.S. Yang ,  Chang Chao-Chia ,  Kevin Hsia

发明人： Spencer Su ,  James Lai ,  Lin Chien-Tsun ,  Captain Chen ,  Allen Chen ,  C.S. Yang ,  Chang Chao-Chia ,  Kevin Hsia

IPC分类号： H01L2144

CPC分类号： H01L23/3114 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05155

摘要： A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.