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    Stackable QFN semiconductor package
    2.
    发明授权
    Stackable QFN semiconductor package 有权
    可堆叠QFN半导体封装

    公开(公告)号：US06337510B1

    公开(公告)日：2002-01-08

    申请号：US09714157

    申请日：2000-11-17

    申请人： Su Chun-Jen ,  Lin Chien-Tsun ,  Chang Chao-Chia ,  Su Yu-Hsien ,  Tseng Ming-Hui

    发明人： Su Chun-Jen ,  Lin Chien-Tsun ,  Chang Chao-Chia ,  Su Yu-Hsien ,  Tseng Ming-Hui

    IPC分类号： H01L23495

    CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49861 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/01079

    摘要： A stackable QFN semiconductor package comprises a die, a lead frame, an electrical connection device, and a molding compound. The die has a plurality of bonding pads on its topside. The lead frame consists of a plurality of inner leads around edge of the die and each inner lead is divided into the body and the finger extending from the body. The body is thicker than the die and exposes its upper surface and lower surface for outer electrical connection of the package. The finger extends from the body to above the topside of the die. An electrical connection device connects the bonding pad of die and the finger of inner lead, thus electrically connect the die and the inner lead of lead frame. A molding compound seals around outer edge of the inner lead and seals off at least said electrical connection device; therefore provide ability of stack, thinner package and simplicity.

    摘要翻译： 可堆叠的QFN半导体封装包括管芯，引线框架，电连接装置和模塑料。 模具在其顶部具有多个接合焊盘。 引线框架由围绕模具的边缘的多个内部引线组成，并且每个内部引线被分为主体和从主体延伸的手指。 主体比模具更厚，并暴露其上表面和下表面，用于封装的外部电连接。 手指从身体延伸到模具的顶部之上。 电连接装置连接管芯的焊盘和内引线的指状物，从而将引线框架的管芯和内引线电连接。 模制化合物围绕内引线的外边缘密封，至少密封所述电连接装置; 因此提供堆叠能力，更薄的封装和简单性。

    QFN semiconductor package
    3.
    发明授权
    QFN semiconductor package 有权
    QFN半导体封装

    公开(公告)号：US06459148B1

    公开(公告)日：2002-10-01

    申请号：US09709339

    申请日：2000-11-13

    申请人： Su Chun-Jen ,  Lin Chien-Tsun ,  Chang Chao-Chia ,  Su Yu-Hsien ,  Tseng Ming-Hui

    发明人： Su Chun-Jen ,  Lin Chien-Tsun ,  Chang Chao-Chia ,  Su Yu-Hsien ,  Tseng Ming-Hui

    IPC分类号： H01L2348

    CPC分类号： H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires and a molding compound. The die has an upward topside with a plurality of bonding pads. The lead frame consists of a plurality of inner leads, wherein each inner lead is divided into the front finger portion, the middle protruding portion and the rare connecting portion. The front finger portion is the position of the inner lead to which a bonding wire wire-bonds from the bonding pad of the die. The rare connecting portion is for the electrical out-connection of the package. The middle protruding portion is at height level higher than the front finger portion and the rare connecting portion. The bonding wires electrically connect the bonding pads of the die with the front finger portions of inner leads by means of wire-bonding. A molding compound seals off at least said bonding wires and at least exposes the downside of the die and some surface of the rare connecting portion of each inner lead, therefore improve stability of the inner lead whenever during wire-bonding or after encapsulating.

    摘要翻译： QFN半导体封装包括半导体管芯，引线框架，接合线和模塑料。 模具具有多个接合焊盘的向上的顶部。 引线框架由多个内引线构成，其中每个内引线被分成前指部分，中间突出部分和罕见连接部分。 前指部分是接合线从芯片的焊盘焊接到其上的内引线的位置。 罕见的连接部分用于封装的电连接。 中间突出部的高度比前指部和罕见的连接部高。 接合线通过引线接合将管芯的接合焊盘与内部引线的前指部分电连接。 模制化合物至少密封所述接合线，并且至少暴露出管芯的下侧和每个内部引线的稀有连接部分的某些表面，从而在引线接合期间或在封装之后提高内部引线的稳定性。