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公开(公告)号:US07037399B2
公开(公告)日:2006-05-02
申请号:US10084869
申请日:2002-03-01
申请人: Quinn K. Tong , Yue Xiao , Bodan Ma , Sun Hee Hong
发明人: Quinn K. Tong , Yue Xiao , Bodan Ma , Sun Hee Hong
IPC分类号: B32B31/12
CPC分类号: H01L23/293 , C08G59/5093 , C08G59/686 , H01L21/563 , H01L24/29 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83856 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , Y10T156/1062 , Y10T428/12528 , H01L2924/3512 , H01L2924/00 , H01L2924/0665
摘要: A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
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公开(公告)号:US06833629B2
公开(公告)日:2004-12-21
申请号:US10020638
申请日:2001-12-14
申请人: Bodan Ma , Sun Hee Hong , Quinn K. Tong
发明人: Bodan Ma , Sun Hee Hong , Quinn K. Tong
IPC分类号: H01L2328
CPC分类号: C08G59/18 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83856 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01056 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/14 , H01L2924/15747 , H01L2924/00015 , H01L2924/0665 , H01L2924/00
摘要: A silicon wafer has a B-stageable underfill material deposited on the active face of the wafer. The B-stageable underfill comprises a first composition with a lower curing temperature and a second composition with a higher curing temperature, characterized in that the first composition has been fully cured.
摘要翻译: 硅晶片具有沉积在晶片的有源面上的B级的底部填充材料。 B阶段的底部填充物包括具有较低固化温度的第一组合物和具有较高固化温度的第二组合物,其特征在于第一组合物已经完全固化。
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