公开(公告)号：US20210222043A1

公开(公告)日：2021-07-22

申请号：US17155038

申请日：2021-01-21

申请人： SunRay Scientific, Inc.

发明人： Andrew Stemmermann

IPC分类号： C09K5/14 ,  H01L23/373 ,  H01L23/367 ,  H05K7/20 ,  C09J9/00 ,  C09J183/04 ,  C09J5/06 ,  C09J7/32 ,  C09J7/10 ,  F28F13/18

摘要： Compositions for thermal interface materials comprising magnetically-alignable, thermally-conductive, electrically-nonconductive particles in a matrix comprising curable polymers are provided. The compositions are also useful for use as heat sinks. Methods are provided for the use of such compounds for thermal management and heat dissipation in the electronics industry.

公开(公告)号：US20230189449A1

公开(公告)日：2023-06-15

申请号：US18108633

申请日：2023-02-12

申请人： SunRay Scientific, Inc.

发明人： Andrew Stemmermann

IPC分类号： H05K3/30 ,  H05K13/00 ,  H05K13/04

CPC分类号： H05K3/305 ,  H05K13/0015 ,  H05K13/0069 ,  H05K13/0469 ,  H05K2203/104 ,  H05K2203/0165 ,  H05K2203/166 ,  H05K2203/0195

摘要： Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.