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公开(公告)号：US20240120903A1
公开(公告)日：2024-04-11
申请号：US18222532
申请日：2023-07-17
Applicant: Suzhou HunterSun Electronics Co., Ltd.
Inventor： Hairui LIU , Zhiguo LAI , Qinghua YANG
CPC classification number: H03H9/542 , H03H9/02125 , H03H9/0514
Abstract: A semiconductor device including a first functional module arranged on a first substrate and having a chip, an electrical connection component and a sealing ring, where the sealing ring surrounds the chip, and the chip is electrically connected to the electrical connection component; a second functional module having a packaging substrate, where the packaging substrate includes at least two metal layers and a dielectrical layer between the metal layers; a third functional module having multiple redistribution lines and multiple micro through holes for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate, where the second substrate is sealed with the first substrate.
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Patent Agency Ranking
2.发明公开公开(公告)号：US20240243718A1
公开(公告)日：2024-07-18
申请号：US18567999
申请日：2021-12-31
Applicant: Suzhou HunterSun Electronics Co., Ltd
Inventor： Hairui LIU , Zhiguo LAI , Zhaoyun TANG , Qinghua YANG
CPC classification number: H03H9/02015 , H03H3/02 , H03H9/17
Abstract: The present disclosure relates to a piezoelectric structure with an optimized electromechanical coupling coefficient, a method for manufacturing the piezoelectric structure, and a piezoelectric resonator including the piezoelectric structure. The piezoelectric structure according to the present disclosure may include a piezoelectric layer doped with a first doping element at a first doping concentration. The first doping concentration varies along a thickness direction of the piezoelectric layer with at least two change rates. An electromechanical coupling coefficient of the piezoelectric layer continuously varies along the thickness direction of the piezoelectric layer. According to the present disclosure, a piezoelectric structure with an electromechanical coupling coefficient varying continuously and/or cyclically along a thickness direction of a piezoelectric layer may be obtained without significant increase of extra process cost, and a figure of merit of a piezoelectric resonator including the piezoelectric structure is finally improved.
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公开(公告)号：US11973488B1
公开(公告)日：2024-04-30
申请号：US18373212
申请日：2023-09-26
Applicant: Suzhou HunterSun Electronics Co., Ltd.
Inventor： Zhiguo Lai , Qinghua Yang
CPC classification number: H03H9/17 , H01L22/30 , H03H3/02 , H03H9/131 , H03H9/02007
Abstract: A resonator for testing, a method for manufacturing a resonator for testing, and a method for testing a resonator are provided. The resonator for testing includes: a testing substrate, a testing bottom electrode, a testing piezoelectric layer, a testing top electrode, at least one first testing electrode, and at least one second testing electrode. The first testing electrode is connected to the testing bottom electrode, the second testing electrode is connected to the testing top electrode, a spacing region is arranged between the first testing electrode and the second testing electrode, and a thickness between the testing piezoelectric layer and at least one of the first testing electrode and the second testing electrode is greater than a predetermined thickness to insulate the first testing electrode and the second testing electrode. With the technical solutions according to the present disclosure, the accuracy of the detected resonance frequency adjustment amount caused by the mass loading layer to be tested is improve.
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公开(公告)号：US12126327B2
公开(公告)日：2024-10-22
申请号：US18222532
申请日：2023-07-17
Applicant: Suzhou HunterSun Electronics Co., Ltd.
Inventor： Hairui Liu , Zhiguo Lai , Qinghua Yang
CPC classification number: H03H9/542 , H03H9/02125 , H03H9/0514
Abstract: A semiconductor device including a first functional module arranged on a first substrate and having a chip, an electrical connection component and a sealing ring, where the sealing ring surrounds the chip, and the chip is electrically connected to the electrical connection component; a second functional module having a packaging substrate, where the packaging substrate includes at least two metal layers and a dielectric layer between the metal layers; a third functional module having multiple redistribution lines and multiple micro through holes for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate, where the second substrate is sealed with the first substrate.
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5.发明公开公开(公告)号：US20240120899A1
公开(公告)日：2024-04-11
申请号：US18373212
申请日：2023-09-26
Applicant: Suzhou HunterSun Electronics Co., Ltd.
Inventor： Zhiguo Lai , Qinghua Yang
CPC classification number: H03H9/17 , H01L22/30 , H03H3/02 , H03H9/131 , H03H9/02007
Abstract: A resonator for testing, a method for manufacturing a resonator for testing, and a method for testing a resonator are provided. The resonator for testing includes: a testing substrate, a testing bottom electrode, a testing piezoelectric layer, a testing top electrode, at least one first testing electrode, and at least one second testing electrode. The first testing electrode is connected to the testing bottom electrode, the second testing electrode is connected to the testing top electrode, a spacing region is arranged between the first testing electrode and the second testing electrode, and a thickness between the testing piezoelectric layer and at least one of the first testing electrode and the second testing electrode is greater than a predetermined thickness to insulate the first testing electrode and the second testing electrode. With the technical solutions according to the present disclosure, the accuracy of the detected resonance frequency adjustment amount caused by the mass loading layer to be tested is improve.
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公开(公告)号：US20230155570A1
公开(公告)日：2023-05-18
申请号：US17919464
申请日：2021-04-19
Applicant: Suzhou HunterSun Electronics Co., Ltd.
Inventor： Wu MING , Tang ZHAOYUN , Yang QINGHUA , Lai ZHIGUO , Wang JIAYOU
CPC classification number: H03H9/205 , H03H9/02015 , H03H9/173 , H03H9/174 , H03H3/02 , H03H9/131 , H03H2003/021 , H03H2003/023
Abstract: A BAW resonator includes: a piezoelectric film array, including multiple piezoelectric films between a substrate of a chip and a capping layer on the top, where multiple first cavities are provided between adjacent piezoelectric films in a vertical direction, between the piezoelectric films and the capping layer, and between the piezoelectric films and the substrate, second cavities are shared between adjacent piezoelectric films in a first direction in a horizontal plane, and third cavities are shared between adjacent piezoelectric films in a second direction in the horizontal plane; multiple electrode layers, covering at least the top surface and bottom surface of each of the piezoelectric films; and multiple electrode interconnection layers, connected to the electrode layers on the bottom surfaces of the piezoelectric films along sidewalls of the third cavities.
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