公开(公告)号：US08025776B2

公开(公告)日：2011-09-27

申请号：US11926509

申请日：2007-10-29

申请人： Myung-Suk Chun ,  Tae Ha Kim

发明人： Myung-Suk Chun ,  Tae Ha Kim

IPC分类号： C23C14/34

CPC分类号： C23C14/165 ,  C23C14/042 ,  G01N27/44791

摘要： Embodiments of the present invention may provide a microchip applicable to an electrophoresis employing UV detection and a method of manufacturing the same. The microchip of the present invention has a glass channel plate, which is formed on an upper surface thereof with a loading channel and a separation channel and is provided on the upper surface thereof with an optical slit layer made of silicon except the channel region, and a glass reservoir plate, which is formed with sample solution reservoirs and buffer solution reservoirs. The loading channel and the separation channel are formed on the channel plate by deep reactive ion etching. The sample solution reservoirs and the buffer solution reservoirs are formed in the reservoir plate by sand blasting. The channel plate and the reservoir plate are combined by anodic bonding the optical slit layer and the reservoir plate. Electrodes for sample and electrodes for buffer are deposited by sputtering Pt with a shadow mask after anodic bonding.

摘要翻译： 本发明的实施方式可以提供适用于使用UV检测的电泳的微芯片及其制造方法。 本发明的微芯片具有玻璃通道板，其在其上表面上形成有加载通道和分离通道，并且在其上表面上设置除了通道区域之外的由硅制成的光学狭缝层，以及 一个玻璃储存器板，形成有样品溶液储存器和缓冲溶液储存器。 通过深反应离子蚀刻在通道板上形成加载通道和分离通道。 样品溶液储层和缓冲液储层通过喷砂形成在储层板中。 通过阳极接合光学狭缝层和储存器板来组合通道板和储存器板。 样品电极和缓冲液电极在阳极接合后用阴罩溅射Pt沉积。

公开(公告)号：US06295728B1

公开(公告)日：2001-10-02

申请号：US09327159

申请日：1999-06-03

申请人： Eon-Min Shin ,  Kyu-Dong Lee ,  Tae-Ha Kim ,  Doo-Won Kang ,  Bum-Suck Kim ,  Yang-Koog Kim ,  Seong-Deok Lee

发明人： Eon-Min Shin ,  Kyu-Dong Lee ,  Tae-Ha Kim ,  Doo-Won Kang ,  Bum-Suck Kim ,  Yang-Koog Kim ,  Seong-Deok Lee

IPC分类号： A05K334

CPC分类号： H05K13/0061 ,  H05K13/04 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5137 ,  Y10T29/53022 ,  Y10T29/53178

摘要： A system for manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.

摘要翻译： 一种用于制造印刷电路板组件的系统，其在具有用于存储部件插入指令图和显示部件插入指令的计算机的系统中实现，以及用于焊接印刷电路板的焊接单元，包括：组装不同类型的印刷电路 板块从零件检查并在许多细胞检查; 根据每个电池的计算机显示的零件插入指令，将不同类型的印刷电路板安装在载体上，并通过传送输送线将它们移动到焊接单元; 并将具有完全焊接的印刷电路板的载体返回到通过返回输送线为载体识别的每个电池。

公开(公告)号：US20090107844A1

公开(公告)日：2009-04-30

申请号：US11926509

申请日：2007-10-29

申请人： Myung-Suk Chun ,  Tae Ha Kim

发明人： Myung-Suk Chun ,  Tae Ha Kim

IPC分类号： B01D57/02 ,  C03C15/00 ,  C23C14/34

CPC分类号： C23C14/165 ,  C23C14/042 ,  G01N27/44791

摘要： Embodiments of the present invention may provide a microchip applicable to an electrophoresis employing UV detection and a method of manufacturing the same. The microchip of the present invention has a glass channel plate, which is formed on an upper surface thereof with a loading channel and a separation channel and is provided on the upper surface thereof with an optical slit layer made of silicon except the channel region, and a glass reservoir plate, which is formed with sample solution reservoirs and buffer solution reservoirs. The loading channel and the separation channel are formed on the channel plate by deep reactive ion etching. The sample solution reservoirs and the buffer solution reservoirs are formed in the reservoir plate by sand blasting. The channel plate and the reservoir plate are combined by anodic bonding the optical slit layer and the reservoir plate. Electrodes for sample and electrodes for buffer are deposited by sputtering Pt with a shadow mask after anodic bonding.

摘要翻译： 本发明的实施方式可以提供适用于使用UV检测的电泳的微芯片及其制造方法。 本发明的微芯片具有玻璃通道板，其在其上表面上形成有加载通道和分离通道，并且在其上表面上设置除了通道区域之外的由硅制成的光学狭缝层，以及 一个玻璃储存器板，形成有样品溶液储存器和缓冲溶液储存器。 通过深反应离子蚀刻在通道板上形成加载通道和分离通道。 样品溶液储层和缓冲液储层通过喷砂形成在储层板中。 通过阳极接合光学狭缝层和储存器板来组合通道板和储存器板。 样品电极和缓冲液电极在阳极接合后用阴罩溅射Pt沉积。

公开(公告)号：US6145190A

公开(公告)日：2000-11-14

申请号：US978469

申请日：1997-11-25

申请人： Eon-Min Shin ,  Kyu-Dong Lee ,  Tae-Ha Kim ,  Doo-Won Kang ,  Bum-Suck Kim ,  Yang-Koog Kim ,  Seong-Deok Lee

发明人： Eon-Min Shin ,  Kyu-Dong Lee ,  Tae-Ha Kim ,  Doo-Won Kang ,  Bum-Suck Kim ,  Yang-Koog Kim ,  Seong-Deok Lee

IPC分类号： B23P19/00 ,  B23P21/00 ,  H01L21/00 ,  H05K3/00 ,  H05K3/34 ,  H05K13/00

CPC分类号： H05K13/08 ,  H05K13/0061 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5137 ,  Y10T29/53022 ,  Y10T29/53178

摘要： A method of manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes the steps of: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.

摘要翻译： 一种制造印刷电路板组件的方法，该印刷电路板组件在具有用于存储部件插入指令图和显示部件插入指令的计算机的系统中以及用于焊接印刷电路板的焊接单元的系统中实现，包括以下步骤：组装不同类型 印刷电路板从零件和多个细胞检查他们; 根据每个电池的计算机显示的零件插入指令，将不同类型的印刷电路板安装在载体上，并通过传送输送线将它们移动到焊接单元; 并将具有完全焊接的印刷电路板的载体返回到通过返回输送线为载体识别的每个电池。