摘要:
A radiation detection apparatus comprising semiconductor substrates each having a first surface on which a photoelectric conversion portion is formed and a second surface opposite to the first surface; a scintillator layer, placed over the first surfaces of the semiconductor substrates, for converting radiation into light; and an elastic member, placed between a base and the second surfaces, for supporting the second surfaces of the semiconductor substrates such that the first surfaces of the semiconductor substrates are flush with each other is provided. In measurement of the elastic member as a single body, an amount of stretch of a cubic specimen in a direction parallel to the first surface when being compressed in a direction perpendicular to the first surface is smaller than an amount of stretch of the specimen in the direction perpendicular to the first surface when being compressed in the direction parallel to the first surface.
摘要:
A radiation imaging apparatus includes a substrate, at least one imaging element, a scintillator, a first heat peelable adhesive member which fixes the substrate to the imaging element, and a second heat peelable adhesive member which fixes the imaging element to the scintillator. An adhesive strength of the first heat peelable member is decreased by heat. A temperature of the first heat peelable adhesive member at which the adhesive strength is decreased is substantially equal to a temperature at which second heat peelable adhesive member fixes the imaging element to the scintillator. A heat transfer quantity per unit time of the substrate is different from that of the scintillator.
摘要:
The present invention provides a radiation image pickup apparatus in which one or more image pickup elements are easily exchanged.A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.
摘要:
A radiation detection apparatus comprising semiconductor substrates each having a first surface on which a photoelectric conversion portion is formed and a second surface opposite to the first surface; a scintillator layer, placed over the first surfaces of the semiconductor substrates, for converting radiation into light; and an elastic member, placed between a base and the second surfaces, for supporting the second surfaces of the semiconductor substrates such that the first surfaces of the semiconductor substrates are flush with each other is provided. In measurement of the elastic member as a single body, an amount of stretch of a cubic specimen in a direction parallel to the first surface when being compressed in a direction perpendicular to the first surface is smaller than an amount of stretch of the specimen in the direction perpendicular to the first surface when being compressed in the direction parallel to the first surface.
摘要:
A radiation detection apparatus includes a scintillator panel having a scintillator layer which converts radiation into light and a scintillator protective layer which protects the scintillator layer, and a sensor panel having a sensor array in which a plurality of photoelectric converters which detect light from the scintillator layer are arranged and a sensor protective layer which protects the sensor array. The scintillator panel is bonded to the sensor panel by making the scintillator layer adhere to the sensor protective layer by using the scintillator protective layer as an adhesive material. A principal component of the scintillator protective layer is the same as a principal component of the sensor protective layer.
摘要:
A scintillator includes a scintillator layer which converts radiation into light, the scintillator layer having a first end forming part of a contour of the scintillator layer and a second end forming another part of the contour, wherein the first end and the second end are located on opposite sides of the scintillator layer when viewed from the center of the scintillator layer, wherein an efficiency of conversion from radiation into light decreases from the first end to the second end.
摘要:
A scintillator includes a scintillator layer which converts radiation into light, the scintillator layer having a first end forming part of a contour of the scintillator layer and a second end forming another part of the contour, wherein the first end and the second end are located on opposite sides of the scintillator layer when viewed from the center of the scintillator layer, wherein an efficiency of conversion from radiation into light decreases from the first end to the second end.
摘要:
A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.
摘要:
A radiation detection apparatus includes a scintillator panel having a scintillator layer which converts radiation into light and a scintillator protective layer which protects the scintillator layer, and a sensor panel having a sensor array in which a plurality of photoelectric converters which detect light from the scintillator layer are arranged and a sensor protective layer which protects the sensor array. The scintillator panel is bonded to the sensor panel by making the scintillator layer adhere to the sensor protective layer by using the scintillator protective layer as an adhesive material. A principal component of the scintillator protective layer is the same as a principal component of the sensor protective layer.
摘要:
A radiation imaging apparatus includes a substrate, at least one imaging element, a scintillator, a first heat peelable adhesive member which fixes the substrate to the imaging element, and a second heat peelable adhesive member which fixes the imaging element to the scintillator. An adhesive strength of the first heat peelable member is decreased by heat. A temperature of the first heat peelable adhesive member at which the adhesive strength is decreased is substantially equal to a temperature at which second heat peelable adhesive member fixes the imaging element to the scintillator. A heat transfer quantity per unit time of the substrate is different from that of the scintillator.