公开(公告)号：US08551623B2

公开(公告)日：2013-10-08

申请号：US12525157

申请日：2008-02-19

Applicant: Masaharu Yamamoto ,  Takayuki Furujo

Inventor： Masaharu Yamamoto ,  Takayuki Furujo

IPC: B32B15/01

CPC classification number: H03H9/1014 ,  H01L23/04 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15787 ,  H03H9/1071 ,  Y10T428/12222 ,  Y10T428/1241 ,  Y10T428/12715 ,  Y10T428/12889 ,  Y10T428/12944 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 μm or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.

Abstract translation: 提供一种气密密封盖，通过该密封帽在用于密封小型化电子部件存储包装的焊接材料中减少了使用量。 一种气密密封盖（10）用于电子部件储存包装（100），其包括用于存储电子部件（40）的电子部件存放部件（20）。 气密密封盖设有基材（1）; 基底层（2），其形成在所述基材的表面上并含有Ni; 并且形成在基层上的焊料层（6）的厚度为10μm以下，由Au和Sn构成。 焊接材料层中的Au的含有率为43质量％以上，优选为64质量％以下。

公开(公告)号：US20100104887A1

公开(公告)日：2010-04-29

申请号：US12525157

申请日：2008-02-19

Applicant: Masaharu Yamamoto ,  Takayuki Furujo

Inventor： Masaharu Yamamoto ,  Takayuki Furujo

IPC: B23K35/02 ,  B23K31/02

CPC classification number: H03H9/1014 ,  H01L23/04 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15787 ,  H03H9/1071 ,  Y10T428/12222 ,  Y10T428/1241 ,  Y10T428/12715 ,  Y10T428/12889 ,  Y10T428/12944 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 μm or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.

Abstract translation: 提供一种气密密封盖，通过该密封帽在用于密封小型化电子部件存储包装的焊接材料中减少了使用量。 一种气密密封盖（10）用于电子部件储存包装（100），其包括用于存储电子部件（40）的电子部件存放部件（20）。 气密密封盖设有基材（1）; 基底层（2），其形成在所述基材的表面上并含有Ni; 并且形成在基底层上的焊料层（6）的厚度为10μm以下，由Au和Sn构成。 焊接材料层中的Au的含有率为43质量％以上，优选为64质量％以下。