Method for manufacturing electronic component
    3.
    发明授权
    Method for manufacturing electronic component 有权
    电子元件制造方法

    公开(公告)号:US06569367B1

    公开(公告)日:2003-05-27

    申请号:US09578370

    申请日:2000-05-25

    IPC分类号: B29C6708

    摘要: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

    摘要翻译: 本发明的目的是减少用于形成侧面电极的导电糊剂的施加量的不均匀性,以便从部件主体的侧面的一部分延伸到邻接的面的一部分 侧面,其中导电膏被填充到设置在狭缝板上的狭缝中,并且组件主体被设置成使其侧面朝向狭缝板的第一主面侧,然后允许挡板构件进行弹性变形 通过将包括弹性材料的活门构件通过压缩构件上的突起压缩而向狭缝的内侧施加,由此施加导电膏,以将膏从组件主体的侧面的一部分延伸到一部分 的侧面,同时将导电浆料供给在狭缝中,以便在第一主面上膨胀。