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公开(公告)号：US09010384B2
公开(公告)日：2015-04-21
申请号：US13364789
申请日：2012-02-02
IPC分类号： B65B31/04 , H01L21/54 , B01L1/00 , H01L21/677
CPC分类号： H01L21/67772 , Y10S414/135 , Y10T137/8593
摘要： A load part has a nozzle unit having outlets for generating outflow and/or inflow of gas used for replacing the atmosphere of a wafer storage container, in a direction approximately parallel to spaces between adjacent wafers being stored, are a driving unit for extending the nozzle unit to a door opening portion.
摘要翻译： 负载部具有喷嘴单元，该喷嘴单元具有用于产生用于更换晶片储存容器的气体的流出和/或流入的出口，所述气体在大致平行于存储的相邻晶片之间的空间的方向上是用于使喷嘴延伸的驱动单元 单元到门开口部分。
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公开(公告)号：US20090169342A1
公开(公告)日：2009-07-02
申请号：US11630123
申请日：2004-06-21
IPC分类号： H01L21/677
CPC分类号： H01L21/67775 , H01L21/67772
摘要： A load port (100) comprises: a mounting base (101) for mounting a wafer carrier (10); a nozzle unit (110) having nozzle outlets (111) for generating an outflow/inflow of a purge gas in a direction approximately parallel to spaces (A) between wafers (1) stored within the wafer carrier (10) so as to replace the atmosphere of the wafer carrier (10); a driving unit including a nozzle driving motor (166) etc., for extending the nozzle unit (110) toward a door opening portion (202) of the load port (100) formed near a wall face (201) of a clean room where a wafer processing apparatus has been installed; an airtight space forming unit (120) which can be connected to a container opening (12) in an airtight manner, thereby forming an airtight space (B) that communicates with the interior space of the wafer carrier (10); a control unit (160) for controlling the switching of the flow of the purge gas generated by the nozzle unit (110) according to the oxygen concentration that indicates the purge degree of the atmosphere of the wafer carrier (10); etc.
摘要翻译： 负载端口（100）包括：用于安装晶片载体（10）的安装基座（101）; 具有喷嘴出口（111）的喷嘴单元（110），用于在与晶片载体（10）中存储的晶片（1）之间的空间（A）大致平行的方向上产生吹扫气体的流出/流入，以便代替 晶片载体（10）的气氛; 驱动单元，其包括喷嘴驱动马达（166）等，用于将喷嘴单元（110）朝向在洁净室的壁面（201）附近形成的负载口（100）的门开口部（202）延伸， 已经安装了晶片处理装置; 气密空间形成单元（120），其可以气密地连接到容器开口（12），从而形成与晶片载体（10）的内部空间连通的气密空间（B）; 根据表示晶片载体（10）的气氛的吹扫度的氧浓度，控制由喷嘴单元（110）产生的吹扫气体的流量切换的控制单元（160）。 等等
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公开(公告)号：US20110303125A1
公开(公告)日：2011-12-15
申请号：US11667339
申请日：2004-11-09
申请人： Hiroshi Itou , Takehiko Yoshimura , Masaru Seki , Makoto Maejima
发明人： Hiroshi Itou , Takehiko Yoshimura , Masaru Seki , Makoto Maejima
IPC分类号： A47B37/00
CPC分类号： H01L21/67775
摘要： A load port, which can selectively place wafer carriers differing in size on a table and can map wafers differing in size stored in the wafer carriers, and an adaptor, which can indirectly attach a wafer carrier on the table, are provided. A load port (100) includes a movable table (110) movably provided on the table (101), a module (161) for determining a carrier, and a module (162) for mapping a wafer. A wafer carrier (200) storing wafers (200A) is indirectly seated on the movable table via an adaptor (10), or a wafer carrier (300) storing wafers (300A) is directly seated on the movable table. The module (161) detects which of the wafer carriers is seated on the movable table and outputs a detection signal in response to the wafer carriers. The module (162) conducts mapping for the wafers, receiving the detection signal sent from the module (161).
摘要翻译： 一种负载端口，其可以选择性地将尺寸不同的晶片载体放置在台上，并且可以映射存储在晶片载体中的尺寸不同的晶片载体，以及可以间接地将晶片载体附接到工作台上的适配器。 负载端口（100）包括可移动地设置在工作台（101）上的可移动台（110），用于确定载体的模块（161）和用于映射晶片的模块（162）。 存储晶片（200A）的晶片载体（200）经由适配器（10）间接地安置在可移动台上，或者存储晶片（300A）的晶片载体（300）直接安置在可移动台上。 模块（161）检测哪个晶片载体位于可移动台上，并响应于晶片载体输出检测信号。 模块（162）对晶片进行映射，接收从模块（161）发送的检测信号。
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公开(公告)号：US20130000757A1
公开(公告)日：2013-01-03
申请号：US13364789
申请日：2012-02-02
IPC分类号： F03B11/02
CPC分类号： H01L21/67772 , Y10S414/135 , Y10T137/8593
摘要： A load part has a nozzle unit having outlets for generating outflow and/or inflow of gas used for replacing the atmosphere of a wafer storage container, in a direction approximately parallel to spaces between adjacent wafers being stored, are a driving unit for extending the nozzle unit to a door opening portion.
摘要翻译： 负载部具有喷嘴单元，该喷嘴单元具有用于产生用于更换晶片储存容器的气体的流出和/或流入的出口，所述气体在大致平行于存储的相邻晶片之间的空间的方向上是用于使喷嘴延伸的驱动单元 单元到门开口部分。
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5.发明申请公开(公告)号：US20080260498A1
公开(公告)日：2008-10-23
申请号：US11547621
申请日：2004-04-07
IPC分类号： H01L23/02
CPC分类号： H01L21/67126 , H01L21/67017 , H01L21/67775
摘要： A connecting device is provided to a wafer carrier for storing a wafer and connected to a purge port having a gas inlet into which a gas for purging an atmosphere in the wafer carrier flows. The connecting device includes, a base; a communication port formed in the base; and a close-contact mechanism that includes, a sealing ring, a groove, and a pressure-reducing passage that communicates with the groove. The pressure in a space defined by the groove and a peripheral edge of the gas inlet is reduced at a position where the base makes contact with the purge port, bringing the gas inlet into close contact with the communication port.
摘要翻译： 将连接装置设置在晶片载体上，用于存储晶片并连接到具有气体入口的吹扫口，用于吹扫晶片载体中的气氛的气体流入该气体入口。 连接装置包括：基座; 在基座上形成的通信端口; 以及紧密接触机构，其包括与槽连通的密封环，槽和减压通路。 由凹槽和气体入口的周缘限定的空间中的压力在基部与吹扫口接触的位置处减小，使得气体入口与连通口紧密接触。
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