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1.发明授权
公开(公告)号：US5559918A
公开(公告)日：1996-09-24
申请号：US379282
申请日：1995-01-27
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译： 一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体， 用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。 电配线层与光半导体装置电连接。
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公开(公告)号：US5434426A
公开(公告)日：1995-07-18
申请号：US118811
申请日：1993-09-10
申请人： Hideto Furuyama , Hiroshi Hamasaki , Mitsuhiro Kushibe , Katsuji Kaminishi , Tamon Kobayashi , Keiji Takaoka
发明人： Hideto Furuyama , Hiroshi Hamasaki , Mitsuhiro Kushibe , Katsuji Kaminishi , Tamon Kobayashi , Keiji Takaoka
CPC分类号： H01S5/5072 , G02B6/43 , H01S5/005 , H01S5/0264 , H01S5/0267 , H01S5/1032 , H01S5/1071 , H01S5/18308 , H01S5/18344 , H01S5/18358 , H01S5/2027
摘要： Disclosed herein is an optical interconnection device having a light source, a plurality of optical interconnecting elements, and a light-receiving element. The optical interconnecting elements are located on an output side of the light source. Each of the elements has first and second major surfaces and comprises an integral unit made of an optical semiconductor element and a grating lens having concentric annular grooves and concentric annular projections, and two electrodes formed on the first and second major surfaces, respectively. The optical semiconductor element and grating lens of each optical interconnecting element are formed on the first major surface, for emitting or receiving light. The light-receiving element is located on an output side of the optical interconnecting elements. The optical interconnecting elements are arranged at substantially regular intervals, each positioned such that the semiconductor element and the grating lens face to the same direction. The grating lens of each of the optical interconnecting elements has optical characteristic which compensates for light-transmitting characteristic corresponding to the interval between the optical connecting element and the next optical interconnecting element.
摘要翻译： 这里公开了具有光源，多个光学互连元件和光接收元件的光学互连装置。 光学互连元件位于光源的输出侧。 每个元件具有第一和第二主表面，并且包括由光学半导体元件制成的整体单元和具有同心环形槽和同心环形突起的光栅透镜，以及分别形成在第一和第二主表面上的两个电极。 每个光学互连元件的光学半导体元件和光栅透镜形成在第一主表面上，用于发射或接收光。 光接收元件位于光互连元件的输出侧。 光学互连元件以基本上规则的间隔布置，每个位置使得半导体元件和光栅透镜面向相同的方向。 每个光学互连元件的光栅透镜具有光学特性，其补偿对应于光学连接元件和下一个光学互连元件之间的间隔的透光特性。
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公开(公告)号：US5412748A
公开(公告)日：1995-05-02
申请号：US160919
申请日：1993-12-03
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译： 一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体， 用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。 电配线层与光半导体装置电连接。
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