Liquid coating system
    1.
    发明授权
    Liquid coating system 失效
    液体涂层系统

    公开(公告)号:US5374312A

    公开(公告)日:1994-12-20

    申请号:US144492

    申请日:1993-11-01

    摘要: A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.

    摘要翻译: 根据本发明的液体涂覆系统包括:液体供应源,具有与液体供应源连通的入口和基本上线性的液体排出部分的喷嘴;压力供给单元,用于在液体供应源 通过压缩气体到喷嘴,用于固定地支撑半导体晶片的旋转卡盘,用于使喷嘴的液体排出部分紧密地面对旋转卡盘上的晶片的上下缸体,以及用于 旋转旋转卡盘。 喷嘴包括从液体供应源供应的液体被收集的液体储存器和与液体储存器连通的大量小通道。 液体涂布系统还包括设置在喷嘴入口和液体供应源之间的连通通道中的空气操作阀,用于将在压力下供给的液体的压力降低到液体储存器。