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公开(公告)号：US07992626B1
公开(公告)日：2011-08-09
申请号：US11532421
申请日：2006-09-15
IPC分类号： H05K7/20
CPC分类号： H01L23/3732 , F28D15/0266 , F28F3/12 , F28F13/185 , H01L23/427 , H01L23/4735 , H01L2924/0002 , Y10S165/907 , H01L2924/00
摘要： A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.
摘要翻译： 组合喷雾和冷板热管理系统，用于在启动期间有效地热管理发热装置。 组合喷雾和冷板热管理系统包括热管理发热装置的喷射单元和与发热装置热连接的冷却剂储存器。 冷却剂储存器包括具有冷却剂通道的多孔介质，用于在喷射冷却剂已经终止之后存储废液冷却剂的体积。 冷却剂储存器流体地连接到喷雾单元内的喷雾室以接收废物冷却剂。
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公开(公告)号：US07779896B2
公开(公告)日：2010-08-24
申请号：US11944244
申请日：2007-11-21
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D5/00 , H01L23/4735 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.
摘要翻译： 流体回收系统适于与冷却系统一起使用，例如用于电子应用中。 在一个示例中，壳体被配置为容纳气体和液体状态的流体，其中流体适用于喷射冷却电子部件。 在外壳内限定多个拾取口。 在冷却系统的一个实施方案中，在每个拾取口中使用的孔口尺寸导致流体从浸没和非浸没的拾取口中排出。
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公开(公告)号：US07717162B2
公开(公告)日：2010-05-18
申请号：US11275307
申请日：2005-12-22
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D5/00 , H01L23/4735 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.
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公开(公告)号：US07159414B2
公开(公告)日：2007-01-09
申请号：US10786243
申请日：2004-02-24
申请人： Charles L Tilton , Thomas D Weir , Paul A Knight
发明人： Charles L Tilton , Thomas D Weir , Paul A Knight
IPC分类号： F28D5/00
CPC分类号： F28D5/00 , H01L23/4336 , H01L23/4735 , H01L2224/16 , H01L2924/3011
摘要： The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.
摘要翻译： 本发明是一种冷板热点喷雾冷却系统，其冷却电子部件，从而在其表面上产生变化的热量。 液体冷却剂分配在从底座突出的喷射销上，其中液体产生非常高的吸热蒸发薄膜。 喷射销位于芯片的产生大热通量的区域上，通常称为热点。 喷嘴的小尺寸和隔离提供了产生非常大的热通量的能力。 可以使用多个喷嘴。
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