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    COOLING APPARATUS
    3.
    发明公开
    COOLING APPARATUS 审中-公开

    公开(公告)号：US20230180437A1

    公开(公告)日：2023-06-08

    申请号：US17972268

    申请日：2022-10-24

    Applicant: Motivair Corporation

    Inventor： Rich S. Whitmore ,  Timothy A. Shedd

    IPC: H05K7/20 ,  H01L23/433

    CPC classification number: H05K7/20345 ,  H05K7/20218 ,  H01L23/4336 ,  H05K7/20254 ,  H01L23/4735

    Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

    Moldable housing design for synthetic jet ejector
    4.
    发明授权
    Moldable housing design for synthetic jet ejector 有权
    合成喷射器的可塑外壳设计

    公开(公告)号：US08646701B2

    公开(公告)日：2014-02-11

    申请号：US11825158

    申请日：2007-07-03

    Applicant: Daniel N. Grimm ,  Ronald Lutz

    Inventor： Daniel N. Grimm ,  Ronald Lutz

    IPC: B05B1/08 ,  B05B1/00

    CPC classification number: G06F1/20 ,  F15D1/02 ,  H01L23/3672 ,  H01L23/4336 ,  H01L23/4735 ,  H05K7/20136

    Abstract: A synthetic jet ejector is provided which comprises a first housing portion (131), and a second housing portion (133) which releasably attaches to the first housing portion, wherein the first and second housing portions form first and second portions, respectively, of at least one passageway (159) adapted to emit at least one synthetic jet.

    Abstract translation: 提供合成喷射器，其包括第一壳体部分（131）和可释放地附接到第一壳体部分的第二壳体部分（133），其中第一和第二壳体部分分别形成第一和第二部分 适于发射至少一个合成射流的至少一个通道（159）。

    Thermal management system for evaporative spray cooling
    5.
    发明授权
    Thermal management system for evaporative spray cooling 有权
    蒸发喷雾冷却热管理系统

    公开(公告)号：US07836706B2

    公开(公告)日：2010-11-23

    申请号：US10260713

    申请日：2002-09-27

    Applicant: Charles L. Tilton ,  Donald E. Tilton

    Inventor： Charles L. Tilton ,  Donald E. Tilton

    IPC: F25D17/02

    CPC classification number: F28D5/00 ,  H01L23/4336 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

    Abstract translation: 一种热管理系统，其配置为使单个和多个雾化器的潜力最大化以有效地冷却微处理器和其它电子设备。 可以是散热器的热管理系统提供了被设置为增加冲击冷却剂液滴的有效性的表面，在一些实施例中提供额外的传热面积，并且允许对受体物体的有效，定制和不同的热管理 热管理。

    Impingement cooled heat sink with low pressure drop
    6.
    发明申请
    Impingement cooled heat sink with low pressure drop 失效
    具有低压降的冲击冷却散热片

    公开(公告)号：US20070272392A1

    公开(公告)日：2007-11-29

    申请号：US11439042

    申请日：2006-05-23

    Applicant: Debashis Ghosh ,  Mohinder Singh Bhatti

    Inventor： Debashis Ghosh ,  Mohinder Singh Bhatti

    IPC: H05K7/20

    CPC classification number: H01L23/4336 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.

    Abstract translation: 在图1和图2中分别示出了用于冷却电子设备的热交换器组件的两个实施例。 每个包括壳体，多个高翅片，多个低翅片，喷嘴板，入口，至少一个出口，主喷嘴和多个次喷嘴。 在图1所示的第一实施例中， 如图1所示，壳体和喷嘴板的形状为圆形。 在图2所示的第二实施例中， 如图3所示，壳体和喷嘴板的形状为矩形。 两个实施例都包括多个次级喷嘴，其在主喷嘴的外侧和喷嘴板的中心轴线对齐。 次级喷嘴将冷却液从中心向外引导到主喷嘴外部，从而产生比其它组件的系统总压力低的系统压降，而不需要多个次级喷嘴。

    Impingement cooled heat sink with uniformly spaced curved channels
    7.
    发明申请
    Impingement cooled heat sink with uniformly spaced curved channels 失效
    具有均匀间隔弯曲通道的冲击式冷却散热器

    公开(公告)号：US20070030655A1

    公开(公告)日：2007-02-08

    申请号：US11197419

    申请日：2005-08-04

    Applicant: Mohinder Bhatti ,  Debashis Ghosh ,  Shrikant Joshi

    Inventor： Mohinder Bhatti ,  Debashis Ghosh ,  Shrikant Joshi

    IPC: H05K7/20

    CPC classification number: H01L23/4336 ,  F28F3/02 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

    Abstract: A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tangential outlet between said exit positions. Each of a plurality of curved fins presents a concave surface and a convex surface and extends from an inner circle with radius concentric with the inlet axis to an outer circle with radius concentric with the inlet axis to define a plurality of curved channels between adjacent fins for directing the flow of cooling fluid radially from the inlet axis. Each of the curved channels is disposed at a constant distance between next adjacent fins for a major length there along from the inner circle with radius toward the outer circle with radius. That substantially constant distance extends from the inner circle with radius to a perpendicular position where the convex surface of that fin is perpendicular to the intersection of the outer circle with radius with the next adjacent fin to the convex surface.

    Abstract translation: 一种用于从电子设备移除热量并包括基座，与基座间隔开并平行的盖的散热器组件，以及围绕入口轴线从内部出口位置到外部出口位置到径向向外螺旋形的外壁， 在所述出口位置之间限定切向出口。 多个弯曲鳍片中的每一个呈现凹面和凸面，并且从与入口轴线同心的半径的内圆周延伸到具有与入口轴线同心的外圆，以在相邻翅片之间限定多个弯曲通道， 引导冷却流体从入口轴线径向流动。 每个弯曲通道在下一个相邻的翅片之间以恒定的距离设置，其长度与内圆半径成半径的外圆。 该基本上恒定的距离从半径的内圆周延伸到垂直位置，其中该翅片的凸面垂直于具有半圆形的外圆与下一相邻翅片相对于凸面的交点。

    Thermosyphon-powered jet-impingement cooling device
    9.
    发明授权
    Thermosyphon-powered jet-impingement cooling device 失效

    公开(公告)号：US5864466A

    公开(公告)日：1999-01-26

    申请号：US758025

    申请日：1996-11-27

    Applicant: Ralph Remsburg

    Inventor： Ralph Remsburg

    IPC: H01L23/433 ,  H05K7/20

    CPC classification number: F28D15/0266 ,  H01L23/4336 ,  H01L2924/0002 ,  H01L2924/3011

    Abstract: A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to the heat spreader plate and heat spreader plate extended surface. Thermal energy is transferred by convection to a single or two-phase coolant media. The heated and/or boiling, less dense coolant begins to expand and rise. The rising coolant or vapor approaches a cold plate and velocity slows due to the greater cross-sectional flow area. The coolant heat energy is released by convection or condensation to the heat dissipation/fluid interface surface, and is then conducted through the cold plate, across the cold plate/heat dissipating device thermal interface, and then to the heat dissipating device. As the cooled media contracts and/or condenses to form droplets, the coolant or droplets begin to fall. As heated or boiling coolant continues to rise, the falling coolant or droplets are both pushed from the high pressure (heated) annulus and pulled from the low pressure (cooled) center through an impingement jet orifice. The coolant impinges against a concave heat/fluid interface surface. The impinging jet of coolant media of the present invention greatly reduces the thermal boundary layer at the point of impingement.

    Cooling structure for electronic circuit package
    10.
    发明授权
    Cooling structure for electronic circuit package 失效
    电子电路封装的冷却结构

    公开(公告)号：US5384687A

    公开(公告)日：1995-01-24

    申请号：US128238

    申请日：1993-09-29

    Applicant: Toshifumi Sano

    Inventor： Toshifumi Sano

    IPC: H01L23/473 ,  H01L23/433 ,  H05K7/20

    CPC classification number: H01L23/4336 ,  H01L2924/0002 ,  Y10S165/908

    Abstract: A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the nozzle openings are formed in the first vertical heat radiation plate for again jetting coolant jetted from the nozzle. A second vertical heat radiation plate is mounted on the bottom heat radiation plate and is disposed so as to surround the first vertical heat radiation plate at least in an opposing relationship to the openings. The coolant jetted from the openings collides with and removes heat from the second vertical heat radiation plate.

    Abstract translation: 冷却结构用于强制冷却电子电路封装。 冷却结构具有安装有电子电路封装的底部散热板，用于向底部散热板喷射冷却剂的喷嘴，安装在底部散热板上的第一垂直散热板， 在第一垂直散热板中形成喷嘴开口，用于再次喷射从喷嘴喷射的冷却剂。 第二垂直散热板安装在底部散热板上并且设置成至少以与开口相对的关系围绕第一垂直散热板。 从开口喷射的冷却剂与第二垂直散热板相撞并从第二垂直散热板移除热量。

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