公开(公告)号：US5311095A

公开(公告)日：1994-05-10

申请号：US883006

申请日：1992-05-14

申请人： Stephen W. Smith ,  Olaf T. von Ramm ,  Paul J. Roeder ,  Thomas R. Poulin

发明人： Stephen W. Smith ,  Olaf T. von Ramm ,  Paul J. Roeder ,  Thomas R. Poulin

IPC分类号： B06B1/06 ,  H01L41/08

CPC分类号： B06B1/064

摘要： Disclosed is a ultrasonic transducer array comprising a ceramic connector having an array of connector pads, a mismatching layer of electrically conducting material connected to the upper surface of the ceramic connector, a piezoelectric transducer chip connected to the mismatching layer, separation means for dividing the piezoelectric chip into a plurality of transducer elements positioned in a two-dimensional array, wherein each one of the plurality of transducer elements is selectively connected to a corresponding one of the connector pads. Also disclosed in a two-dimensional ultrasound transducer array and transducer array for ultrasound imaging.

摘要翻译： 公开了一种超声波换能器阵列，其包括具有连接器焊盘阵列的陶瓷连接器，连接到陶瓷连接器的上表面的导电材料的不匹配层，连接到失配层的压电换能器芯片，用于将压电 芯片转换成定位在二维阵列中的多个换能器元件，其中多个换能器元件中的每一个选择性地连接到相应的一个连接器垫片。 还在二维超声换能器阵列和用于超声成像的换能器阵列中公开。

公开(公告)号：US4965702A

公开(公告)日：1990-10-23

申请号：US368481

申请日：1989-06-19

申请人： John W. Lott ,  Thomas R. Poulin ,  Patrick W. Wallace

发明人： John W. Lott ,  Thomas R. Poulin ,  Patrick W. Wallace

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L21/4846 ,  H01L23/49822 ,  H01L2924/0002 ,  Y10T29/4914 ,  Y10T29/49151 ,  Y10T29/49169

摘要： An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.