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公开(公告)号：US20130044437A1
公开(公告)日：2013-02-21
申请号：US13586053
申请日：2012-08-15
申请人： Michael HORTIG , Thomas SCHRIMPF
发明人： Michael HORTIG , Thomas SCHRIMPF
CPC分类号： G01D11/245 , B81B2201/0235 , B81C1/00333 , H05K5/0078 , Y10T29/49885
摘要： A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.
摘要翻译： 一种用于制造传感器模块的方法，其中在第一制造步骤中设置线部分，其包括用于传感器元件的力配合和/或成形配合的至少一个接收区域，并且在第二生产中 用于制造壳体的步骤，线部分用塑料材料挤压涂覆，使得至少一个接收区域保持通常不含塑料材料，并且传感器元件被固定在适当的位置和/或 在第三制造步骤中，在至少一个接收区域中形状配合。
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公开(公告)号：US09453745B2
公开(公告)日：2016-09-27
申请号：US13586053
申请日：2012-08-15
申请人： Michael Hortig , Thomas Schrimpf
发明人： Michael Hortig , Thomas Schrimpf
CPC分类号： G01D11/245 , B81B2201/0235 , B81C1/00333 , H05K5/0078 , Y10T29/49885
摘要： A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.
摘要翻译： 一种用于制造传感器模块的方法，其中在第一制造步骤中设置线部分，其包括用于传感器元件的力配合和/或成形配合的至少一个接收区域，并且在第二生产中 用于制造壳体的步骤，线部分用塑料材料挤压涂覆，使得至少一个接收区域保持通常不含塑料材料，并且传感器元件被固定在适当的位置和/或 在第三制造步骤中，在至少一个接收区域中形状配合。
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公开(公告)号：US20120247205A1
公开(公告)日：2012-10-04
申请号：US13432159
申请日：2012-03-28
申请人： Michael Hortig , Thomas Schrimpf
发明人： Michael Hortig , Thomas Schrimpf
CPC分类号： G01D11/245 , B81B7/0074 , B81B2201/0235 , B81B2201/0242 , Y10T29/49117
摘要： A sensor module has an electrically conductive part, a first sensor element, and a second sensor element, the first sensor element being situated in a first accommodating area of the conductive part, and the second sensor element being situated in a second accommodating area of the conductive part, and the conductive part furthermore having a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.
摘要翻译： 传感器模块具有导电部分，第一传感器元件和第二传感器元件，第一传感器元件位于导电部分的第一容纳区域中，第二传感器元件位于第二传感器元件的第二容纳区域中 导电部分，并且导电部分还具有位于第一和第二容纳区域之间的弯曲区域，使得第二容纳区域相对于第一容纳区域成一角度定向。
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公开(公告)号：US09408319B2
公开(公告)日：2016-08-02
申请号：US14094272
申请日：2013-12-02
申请人： Eberhard Haiss , Martin Rojahn , Matthias Taglieber , Thomas Schrimpf , Matthias Ludwig , Andreas Blum
发明人： Eberhard Haiss , Martin Rojahn , Matthias Taglieber , Thomas Schrimpf , Matthias Ludwig , Andreas Blum
IPC分类号： H05K7/02 , H05K13/00 , G01D11/24 , G01P1/02 , G01C19/5783
CPC分类号： H05K7/02 , G01C19/5783 , G01D11/245 , G01P1/023 , H05K13/00 , Y10T29/49117
摘要： An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.
摘要翻译： 一种电子部件，其具有模制部件壳体和嵌入在所述部件壳体中用于接触微型部件的导电插入部件，所述插入部分具有用于容纳所述微型部件的容纳区域，所述区域与所述微型部件间隔开， 用于将微组件与组件壳体的材料应力分离。 一种用于制造具有模制部件壳体的电子部件的方法，用于接触嵌入在所述部件壳体中的微型部件的导电插入部分，与所述微型部件间隔开的子区域，其将所述微型部件与材料应力 所述部件壳体在所述外壳材料的固化期间在用于将所述微型部件容纳在所述插入部件上的容纳区域中。
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公开(公告)号：US20140158420A1
公开(公告)日：2014-06-12
申请号：US14094272
申请日：2013-12-02
申请人： Eberhard HAISS , Martin ROJAHN , Matthias TAGLIEBER , Thomas SCHRIMPF , Matthias LUDWIG , Andreas BLUM
发明人： Eberhard HAISS , Martin ROJAHN , Matthias TAGLIEBER , Thomas SCHRIMPF , Matthias LUDWIG , Andreas BLUM
CPC分类号： H05K7/02 , G01C19/5783 , G01D11/245 , G01P1/023 , H05K13/00 , Y10T29/49117
摘要： An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.
摘要翻译： 一种电子部件，其具有模制部件壳体和嵌入在所述部件壳体中用于接触微型部件的导电插入部件，所述插入部分具有用于容纳所述微型部件的容纳区域，所述区域与所述微型部件间隔开， 用于将微组件与组件壳体的材料应力分离。 一种用于制造具有模制部件壳体的电子部件的方法，用于接触嵌入在所述部件壳体中的微型部件的导电插入部分，与所述微型部件间隔开的子区域，其将所述微型部件与材料应力 所述部件壳体在所述外壳材料的固化期间在用于将所述微型部件容纳在所述插入部件上的容纳区域中。
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