公开(公告)号：US20090082730A1

公开(公告)日：2009-03-26

申请号：US12237315

申请日：2008-09-24

申请人： Li Nguyen ,  Athena Phan ,  Tiffany Nguyen

发明人： Li Nguyen ,  Athena Phan ,  Tiffany Nguyen

IPC分类号： A61M5/20

CPC分类号： A61M5/20 ,  A61M5/2053 ,  A61M5/425 ,  A61M2005/206

摘要： An injection device is provided to deposit fluids or medications under the skin. The skin is first drawn up into a cavity of an injection head using a vacuum source. A telescoping housing is then activated to move an entire syringe so that a needle on the syringe penetrates the skin that has been pulled up into the injection head. In one embodiment, the syringe barrel is then retraced away from the skin to deposit fluids under the skin. In another embodiment, the syringe barrel is held stationary while the plunger rod is moved to deposit fluids under the skin.

摘要翻译： 提供注射装置以在皮肤下沉积流体或药物。 使用真空源将皮肤首先拉入注射头的腔。 然后启动伸缩壳体以移动整个注射器，使得注射器上的针穿过已经被拉到注射头中的皮肤。 在一个实施例中，然后将注射器筒从皮肤上回缩以将流体沉积在皮肤下。 在另一个实施例中，当柱塞杆移动以将流体沉积在皮肤下方时，注射器筒保持静止。

公开(公告)号：US20060141641A1

公开(公告)日：2006-06-29

申请号：US10543347

申请日：2004-01-26

申请人： Wenya Fan ,  Victor Lu ,  Michael Thomas ,  Brian Daniels ,  Tiffany Nguyen ,  De-Ling Zhou ,  Ananth Naman ,  Lei Jin ,  Anil Bhanap

发明人： Wenya Fan ,  Victor Lu ,  Michael Thomas ,  Brian Daniels ,  Tiffany Nguyen ,  De-Ling Zhou ,  Ananth Naman ,  Lei Jin ,  Anil Bhanap

IPC分类号： H01L21/00 ,  H01L21/31

CPC分类号： H01L21/31058 ,  H01L21/3105 ,  H01L21/76801 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of repairing voids in a material are described herein that include: a) providing a material having a plurality of reactive silanol groups; b) providing at least one reactive surface modification agent; and c) chemically capping at least some of the plurality of reactive silanol groups with the at least one of the reactive surface modification agents. Methods of carbon restoration in a material are also described that include: a) providing a carbon-deficient material having a plurality of reactive silanol groups; b) providing at least one reactive surface modification agent; and c)chemically capping at least some of the plurality of reactive silanol groups with the at least one of the reactive surface modification agents. In addition, methods are described herein for reducing the condensation of a film and/or a carbon-deficient film that include: a) providing a film having a plurality of reactive silanol groups; b) placing the film into a plasma chamber; c) introducing a plurality of reactive organic moieties-containing silanes into the chamber; and d) allowing the silanes to react with at least some of the reactive silanol groups. Dielectric materials and low-k dielectric materials are described herein that comprise: a) an inorganic material having a plurality of silicon atoms; and b) a plurality of organic moiety-containing silane compounds, wherein the silane compounds are coupled to the inorganic material through at least some of the silicon atoms.

摘要翻译： 本文描述了修复材料中空隙的方法，其包括：a）提供具有多个反应性硅烷醇基团的材料; b）提供至少一种反应性表面改性剂; 和c）使所述多个反应性硅烷醇基团中的至少一些与至少一种反应性表面改性剂化学封端。 还描述了材料中碳修复的方法，其包括：a）提供具有多个反应性硅烷醇基团的缺碳材料; b）提供至少一种反应性表面改性剂; 和c）使所述多个反应性硅烷醇基团中的至少一些与至少一种反应性表面改性剂化学封端。 此外，本文描述了用于减少膜和/或碳缺乏膜的冷凝的方法，其包括：a）提供具有多个反应性硅烷醇基团的膜; b）将膜放入等离子体室中; c）将多个含反应性有机部分的硅烷引入所述室中; 和d）允许硅烷与至少一些反应性硅烷醇基团反应。 介质材料和低k介电材料在本文中描述，其包括：a）具有多个硅原子的无机材料; 和b）多个含有机部分的硅烷化合物，其中硅烷化合物通过至少一些硅原子与无机材料偶联。

公开(公告)号：US07915181B2

公开(公告)日：2011-03-29

申请号：US10543347

申请日：2004-01-26

申请人： Wenya Fan ,  Victor Lu ,  Michael Thomas ,  Brian Daniels ,  Tiffany Nguyen ,  De-Ling Zhou ,  Ananth Naman ,  Lei Jin ,  Anil Bhanap

发明人： Wenya Fan ,  Victor Lu ,  Michael Thomas ,  Brian Daniels ,  Tiffany Nguyen ,  De-Ling Zhou ,  Ananth Naman ,  Lei Jin ,  Anil Bhanap

IPC分类号： H01L21/31

CPC分类号： H01L21/31058 ,  H01L21/3105 ,  H01L21/76801 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of repairing voids in a material are described herein that include: a) providing a material having a plurality of reactive silanol groups; b) providing at least one reactive surface modification agent; and c) chemically capping at least some of the plurality of reactive silanol groups with the at least one of the reactive surface modification agents. Methods of carbon restoration in a material are also described that include: a) providing a carbon-deficient material having a plurality of reactive silanol groups; b) providing at least one reactive surface modification agent; and c)chemically capping at least some of the plurality of reactive silanol groups with the at least one of the reactive surface modification agents. In addition, methods are described herein for reducing the condensation of a film and/or a carbon-deficient film that include: a) providing a film having a plurality of reactive silanol groups; b) placing the film into a plasma chamber; c) introducing a plurality of reactive organic moieties-containing silanes into the chamber; and d) allowing the silanes to react with at least some of the reactive silanol groups. Dielectric materials and low-k dielectric materials are described herein that comprise: a) an inorganic material having a plurality of silicon atoms; and b) a plurality of organic moiety-containing silane compounds, wherein the silane compounds are coupled to the inorganic material through at least some of the silicon atoms.

摘要翻译： 本文描述了修复材料中空隙的方法，其包括：a）提供具有多个反应性硅烷醇基团的材料; b）提供至少一种反应性表面改性剂; 和c）使所述多个反应性硅烷醇基团中的至少一些与至少一种反应性表面改性剂化学封端。 还描述了材料中碳修复的方法，其包括：a）提供具有多个反应性硅烷醇基团的缺碳材料; b）提供至少一种反应性表面改性剂; 和c）使所述多个反应性硅烷醇基团中的至少一些与至少一种反应性表面改性剂化学封端。 此外，本文描述了用于减少膜和/或碳缺乏膜的冷凝的方法，其包括：a）提供具有多个反应性硅烷醇基团的膜; b）将膜放入等离子体室中; c）将多个含反应性有机部分的硅烷引入所述室中; 和d）允许硅烷与至少一些反应性硅烷醇基团反应。 介质材料和低k介电材料在本文中描述，其包括：a）具有多个硅原子的无机材料; 和b）多个含有机部分的硅烷化合物，其中硅烷化合物通过至少一些硅原子与无机材料偶联。