公开(公告)号：US20140287202A1

公开(公告)日：2014-09-25

申请号：US14358059

申请日：2011-11-15

申请人： Takashi Sano ,  Tokinori Terada

发明人： Takashi Sano ,  Tokinori Terada

IPC分类号： B29C59/02 ,  B29C33/58 ,  B29C33/38

CPC分类号： B29C59/02 ,  B29C33/3842 ,  B29C33/58 ,  C25D1/00 ,  C25D1/003 ,  C25D1/22 ,  Y10T428/24802

摘要： A transfer mold that is used in production of a component by electroplating and has high workability and superior durability as well as a component produced thereby are provided. A method therefor includes the steps of forming a pattern of a desired component by providing a reverse pattern of the pattern of the desired component on a metal substrate and etching the metal substrate using the reverse pattern as a mask and treating the reverse pattern with heat or removing the reverse pattern and forming an insulation layer in a portion where the reverse pattern has been removed.

摘要翻译： 提供了通过电镀制造组件并且具有高可加工性和优异的耐久性的转移模以及由此生产的部件。 其方法包括以下步骤：通过在金属基底上提供所需组分的图案的相反图案并使用反向图案作为掩模蚀刻金属基底并用热处理反向图案来形成所需组分的图案，或 去除反向图案并在反向图案被去除的部分中形成绝缘层。

公开(公告)号：US20140311911A1

公开(公告)日：2014-10-23

申请号：US14358291

申请日：2011-11-15

申请人： Takashi Sano ,  Tokinori Terada

发明人： Takashi Sano ,  Tokinori Terada

IPC分类号： C25D1/10

CPC分类号： C25D1/10 ,  B29C33/424

摘要： A multi-stage transfer mold manufacturing method that can save labor in a step of connecting by a multi-stage connection, a multi-stage transfer mold manufactured thereby, and a component produced thereby are provided for production of a multi-stage component by electroplating. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer, creating a transfer mold by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness, and providing a master mold by separating the transfer mold from the metal substrate.

摘要翻译： 提供一种多级转移模具制造方法，其可以通过多级连接的连接步骤，由此制造的多级转移模具及其制造的部件节省劳动，用于通过电镀生产多级部件 。 其方法包括以下步骤：在金属基板上形成具有期望纵横比的部件形状的抗蚀剂图案，抗蚀剂图案的侧壁形成所需的角度，在抗蚀剂图案上形成具有 形状和与上层连接的连接柱的厚度，通过将其上具有连接柱形状的抗蚀剂图案填充到其上的抗蚀图案来形成转印模具，通过电镀将其固定到预定厚度，并通过 从金属基底分离转移模具。

公开(公告)号：US20140291157A1

公开(公告)日：2014-10-02

申请号：US14358300

申请日：2011-11-15

申请人： Takashi Sano ,  Tokinori Terada

发明人： Takashi Sano ,  Tokinori Terada

IPC分类号： C25D1/10 ,  C25D1/00

CPC分类号： C25D1/003 ,  C25D1/00 ,  C25D1/10 ,  C25D1/20 ,  C25D1/22

摘要： A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness and providing a master mold by separating the transfer mold from the metal substrate.

摘要翻译： 提供了一种具有优异的耐久性和高纵横比的转印模具，用于通过电镀制造组分和由其制备的组分。 其方法包括以下步骤：在金属基板上形成具有所需纵横比的部件形状的抗蚀剂图案，抗蚀剂图案的侧壁形成所需的角度，通过将具有 通过电镀到预定厚度的部件的形状，并通过从金属基板分离转移模具来提供母模。