METHOD FOR MANUFACTURING WIRING BOARD
    1.
    发明申请
    METHOD FOR MANUFACTURING WIRING BOARD 审中-公开
    制造接线板的方法

    公开(公告)号:US20120204420A1

    公开(公告)日:2012-08-16

    申请号:US13371947

    申请日:2012-02-13

    IPC分类号: H05K3/10

    摘要: A method for manufacturing a wiring board, which prevents electrostatic destruction generated in a mask pattern, by employing a structured exposure mask at a low cost is provided. The method can comprise the steps of forming a photosensitive resin layer on an insulating layer located underneath a predetermined conductor layer, forming a plating resist by exposing and developing the photosensitive resin layer with an exposure light while an exposure mask is disposed on a surface of the photosensitive resin layer, forming a metal plating layer that has a conductor pattern formed by applying a metal plating to an opening of the plating resist, and removing the plating resist. The exposure mask may have a plurality of graphic patterns, and each corner of the graphic patterns maybe chamfered by 50 micrometers or more so that electrostatic destruction due to electric discharge between the adjacent graphic patterns is prevented.

    摘要翻译: 提供一种通过以低成本采用结构化的曝光掩模来制造布线板的制造方法,其防止在掩模图案中产生的静电破坏。 该方法可以包括以下步骤:在位于预定导体层下方的绝缘层上形成感光性树脂层,通过曝光光曝光和显影感光性树脂层而形成电镀抗蚀剂,同时将曝光掩模设置在 形成具有通过对电镀抗蚀剂的开口施加金属电镀而形成的导体图案的金属镀层,以及去除电镀抗蚀剂。 曝光掩模可以具有多个图形,并且图形的每个角可以倒角50微米以上,从而防止由于相邻图形之间的放电引起的静电破坏。