公开(公告)号：US09198295B2

公开(公告)日：2015-11-24

申请号：US13818825

申请日：2011-08-23

申请人： Tony Lhommeau

发明人： Tony Lhommeau

IPC分类号： H01R9/00 ,  H05K1/18 ,  H01G2/06 ,  H05K3/34 ,  H01G4/12 ,  H01G4/228

CPC分类号： H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613

摘要： A printed circuit includes a substrate onto which at least one ceramic component is attached so as to enable the heat produced by the ceramic component to be discharged and to prevent cracks in the ceramic component and in the substrate. To this end, the ceramic component is attached onto the substrate using two connectors made of metal matrix composite material. The two connectors further have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.

摘要翻译： 印刷电路包括其上附着有至少一个陶瓷部件的基板，以便能够排出由陶瓷部件产生的热量并防止陶瓷部件和基板中的裂纹。 为此，使用由金属基复合材料制成的两个连接器将陶瓷部件附接到基板上。 两个连接器还具有切口，以便使得施加在基板中的机械应力能够承载在连接器中。

公开(公告)号：US20130146348A1

公开(公告)日：2013-06-13

申请号：US13818825

申请日：2011-08-23

申请人： Tony Lhommeau

发明人： Tony Lhommeau

IPC分类号： H05K1/18

CPC分类号： H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613

摘要： A printed circuit includes a substrate onto which at least one ceramic component is attached so as to enable the heat produced by the ceramic component to be discharged and to prevent cracks in the ceramic component and in the substrate. To this end, the ceramic component is attached onto the substrate using two connectors made of metal matrix composite material. The two connectors further have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.

摘要翻译： 印刷电路包括其上附着有至少一个陶瓷部件的基板，以便能够排出由陶瓷部件产生的热量并防止陶瓷部件和基板中的裂纹。 为此，使用由金属基复合材料制成的两个连接器将陶瓷部件附接到基板上。 两个连接器还具有切口，以便使得施加在基板中的机械应力能够承载在连接器中。