公开(公告)号：US5646441A

公开(公告)日：1997-07-08

申请号：US631600

申请日：1996-04-18

申请人： Altaf Hasan ,  J. D. Wilson ,  Tor Kalleberg

发明人： Altaf Hasan ,  J. D. Wilson ,  Tor Kalleberg

IPC分类号： H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H01L23/495

CPC分类号： H01L23/4985 ,  H01L2224/05554 ,  H01L2224/49175 ,  H01L2924/09701 ,  H05K1/118 ,  H05K3/361

摘要： An integrated circuit package which has a plurality of inner surface pads located on a substrate and arranged in an angular pattern about an integrated circuit. The inner surface pads of the package are coupled to the outer surface pads of the integrated circuit with a TAB tape. The TAB tape has a plurality of conductors which each have a first end attached to the outer pads of the integrated circuit and a land portion attached to the inner surface pads of the substrate. The land portions of the tape are also arranged in an angular pattern about the integrated circuit.

摘要翻译： 一种集成电路封装，其具有位于基板上的多个内表面焊盘，并且围绕集成电路以角度图案布置。 封装的内表面焊盘用TAB带耦合到集成电路的外表面焊盘。 TAB带具有多个导体，每个导体具有连接到集成电路的外部焊盘的第一端和附接到衬底的内表面焊盘的焊盘部分。 磁带的接地部分也围绕集成电路以角度图案布置。