公开(公告)号：US20090038823A1

公开(公告)日：2009-02-12

申请号：US12186851

申请日：2008-08-06

申请人： Yoshinori Furihata ,  Toshifumi Machii ,  Kiyotaka Shimada ,  Kazuhiro Yoshida

发明人： Yoshinori Furihata ,  Toshifumi Machii ,  Kiyotaka Shimada ,  Kazuhiro Yoshida

IPC分类号： H01B5/00

CPC分类号： H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R12/777 ,  H05K2201/10318 ,  Y02P70/613 ,  H01L2924/00

摘要： A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.

摘要翻译： 提供了一种具有引线引脚的布线基板，该引线引脚通过导电材料将导线焊接到布线基板上形成的电极焊盘而形成，并且在引脚中，端面侧与形成在引线板的一端的头部的电极焊盘相对 轴部分形成在锥形突出部分中，并且锥形突出部分的顶角也设置在110°至140°的角度范围内，并且导电材料插入在圆锥突起部分和电极焊盘之间，并且还 延伸到头部的平坦部分并到达轴部分的外表面，并且引脚接合到电极焊盘。