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公开(公告)号：US08331101B2
公开(公告)日：2012-12-11
申请号：US12693530
申请日：2010-01-26
申请人： Toshiaki Aoki , Masayoshi Ebe , Kiyotaka Shimada
发明人： Toshiaki Aoki , Masayoshi Ebe , Kiyotaka Shimada
IPC分类号： H05K1/18
CPC分类号： H05K1/145 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/15311 , H01L2924/15331 , H01L2924/19105 , H01L2924/19106 , H05K1/0231 , H05K1/144 , H05K3/3442 , H05K2201/10636 , Y02P70/611 , H01L2924/00012 , H01L2924/00
摘要： A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes.
摘要翻译： 用于安装在包装板上的布线板包括表面安装在面向包装板的表面上的芯片部件。 芯片部件包括其部件主体的两端部的端子电极。 每个端子电极以将形成在端子电极的表面上的镀膜（Sn）分成两部分的形式提供，一部分在布线板侧，另一部分在包装板侧 。 一方面，芯片部件的端子电极中的每一个分离成布线板侧的一部分和封装基板一侧的一部分，并且在每个分离部分的表面上形成镀膜（Sn） 的每个端子电极。
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公开(公告)号：US08153900B2
公开(公告)日：2012-04-10
申请号：US12200201
申请日：2008-08-28
IPC分类号： H01B5/00
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2224/32225 , H01L2924/15312 , H05K2201/10318 , Y02P70/613
摘要： A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.
摘要翻译： 具有引脚的布线基板是通过导电材料将引线焊接到形成在布线基板上的电极焊盘而形成的。 在引导销中，在与轴部的一端形成的头部的电极焊盘相对的端面侧形成有侧面形成为凹面的圆锥突起部。 在导电材料延伸到头部的背面侧超过头部的凸缘部分并到达引脚的轴部的状态下，将引脚接合到电极焊盘。
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公开(公告)号：US20100214751A1
公开(公告)日：2010-08-26
申请号：US12693530
申请日：2010-01-26
申请人： Toshiaki AOKI , Masayoshi Ebe , Kiyotaka Shimada
发明人： Toshiaki AOKI , Masayoshi Ebe , Kiyotaka Shimada
IPC分类号： H05K1/18
CPC分类号： H05K1/145 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/15311 , H01L2924/15331 , H01L2924/19105 , H01L2924/19106 , H05K1/0231 , H05K1/144 , H05K3/3442 , H05K2201/10636 , Y02P70/611 , H01L2924/00012 , H01L2924/00
摘要： A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes.
摘要翻译： 用于安装在包装板上的布线板包括表面安装在面向包装板的表面上的芯片部件。 芯片部件包括其部件主体的两端部的端子电极。 每个端子电极以将形成在端子电极的表面上的镀膜（Sn）分成两部分的形式提供，一部分在布线板侧，另一部分在包装板侧 。 一方面，芯片部件的端子电极中的每一个分离成布线板侧的一部分和封装基板一侧的一部分，并且在每个分离部分的表面上形成镀膜（Sn） 的每个端子电极。
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公开(公告)号：US20090056992A1
公开(公告)日：2009-03-05
申请号：US12200201
申请日：2008-08-28
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2224/32225 , H01L2924/15312 , H05K2201/10318 , Y02P70/613
摘要： A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.
摘要翻译： 具有引脚的布线基板是通过导电材料将引线焊接到形成在布线基板上的电极焊盘而形成的。 在引导销中，在与轴部的一端形成的头部的电极焊盘相对的端面侧形成有侧面形成为凹面的圆锥突起部。 在导电材料延伸到头部的背面侧超过头部的凸缘部分并到达引脚的轴部的状态下，将引脚接合到电极焊盘。
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公开(公告)号：US20090038823A1
公开(公告)日：2009-02-12
申请号：US12186851
申请日：2008-08-06
IPC分类号： H01B5/00
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2924/0002 , H01R12/777 , H05K2201/10318 , Y02P70/613 , H01L2924/00
摘要： A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.
摘要翻译： 提供了一种具有引线引脚的布线基板，该引线引脚通过导电材料将导线焊接到布线基板上形成的电极焊盘而形成，并且在引脚中，端面侧与形成在引线板的一端的头部的电极焊盘相对 轴部分形成在锥形突出部分中，并且锥形突出部分的顶角也设置在110°至140°的角度范围内，并且导电材料插入在圆锥突起部分和电极焊盘之间，并且还 延伸到头部的平坦部分并到达轴部分的外表面，并且引脚接合到电极焊盘。
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公开(公告)号：US06988312B2
公开(公告)日：2006-01-24
申请号：US10451850
申请日：2002-10-29
申请人： Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
发明人： Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
IPC分类号： H05K3/26
CPC分类号： H05K3/4682 , H01L21/4857 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/0097 , H05K3/205 , H05K3/3473 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/0401
摘要： The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the composite metal sheet, to yield intermediates (34) each provided on one side of the metal sheet with the multilayer circuit board body, and etching the metal sheet at an area at which a semiconductor element is to be mounted to remove the material of the metal sheet at that area, to thereby form a frame (10) surrounding the area for the mounting of the semiconductor element.
摘要翻译： 本发明涉及一种用于半导体器件的多层电路板（50）的制造方法，其特征在于，使用复合金属片（14），其中组合有两个金属片，在复合金属片的每一侧上形成用于连接的焊盘 对于半导体元件，所述焊盘由金属材料制成，所述金属材料基本上不被所述金属板的蚀刻剂蚀刻，以及具有暴露所述焊盘的开口的绝缘层，在所述绝缘层上形成布线层（26） 连接到焊盘并具有用于连接到随后形成的另一布线层的焊盘，随后通过必要数量的交替形成的绝缘层和布线层来制造多层电路板主体（20），在绝缘层的最外层 多层电路板主体，设置有位于最外侧绝缘体上的用于外部连接端子的通孔露出焊盘的绝缘层 然后分割复合金属板，得到各自设置在金属板的一侧上的多层电路板体的中间体（34），并在要安装半导体元件的区域上蚀刻金属片 在该区域移除金属片的材料，从而形成围绕用于安装半导体元件的区域的框架（10）。
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公开(公告)号：US4867839A
公开(公告)日：1989-09-19
申请号：US240213
申请日：1988-09-06
CPC分类号： H01L21/565 , B29C45/372 , H05K3/381 , H01L2924/0002 , H01L2924/15312 , H05K2203/1152 , H05K3/181 , Y10T29/49158
摘要： A process for forming a circuit substrate comprising placing an electrodeposited metal foil having a rough surface provided with a large number of fine projections in a cavity of a mold in such a manner that the rough surface faces an inside of the mold cavity; pouring a melting resin into the mold cavity to form a molded article; peeling the metal foil from the molded article to form a large number of fine concavities corresponding to the projections; electroless-plating the resin base to form a metal film; and photoetching to form a circuit pattern on the resin base.
摘要翻译： 一种形成电路基板的方法，包括将具有大量微细突起的粗糙表面的电沉积金属箔放置在模具的空腔中，使粗糙表面面对模腔内; 将熔融树脂浇注到模腔中以形成模制品; 从成形品剥离金属箔，形成与突起对应的大量细小凹部; 对树脂基底进行化学镀以形成金属膜; 并进行光刻以在树脂基底上形成电路图案。
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公开(公告)号：US4546033A
公开(公告)日：1985-10-08
申请号：US573804
申请日：1984-01-25
申请人： Yasushi Tsuchimoto , Shiro Takahata , Kiyotaka Shimada , Koji Tanaka , Susumu Aoki , Tsutomu Yamamoto , Masaaki Ashizawa , Kazuo Nishimoto
发明人： Yasushi Tsuchimoto , Shiro Takahata , Kiyotaka Shimada , Koji Tanaka , Susumu Aoki , Tsutomu Yamamoto , Masaaki Ashizawa , Kazuo Nishimoto
CPC分类号： C09K3/1028 , C09K2003/104 , C09K2003/1081 , C09K2200/0278 , C09K2200/0282 , C09K2200/0286 , C09K2200/0291 , C09K2200/0607 , C09K2200/063 , C09K2200/0692 , C09K2200/0697 , Y10T428/31652 , Y10T428/31659 , Y10T442/2049 , Y10T442/282 , Y10T442/2992
摘要： A gasket sheet obtained by the milling and vulcanization of 50-85% by weight of a fibrous material, 10-50% by weight of a rubber material and at least 1-23% by weight of a water-insoluble and -swelling substance. The gasket sheet may be a one layer or a three layer sheet.
摘要翻译： 通过研磨和硫化50-85重量％的纤维材料，10-50重量％的橡胶材料和至少1-23重量％的不溶于水的溶解物质获得的垫片片材。 衬垫片可以是一层或三层片。
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公开(公告)号：US4969257A
公开(公告)日：1990-11-13
申请号：US240216
申请日：1988-09-06
CPC分类号： H05K3/20 , H05K2201/09118 , H05K2203/0156 , H05K3/382 , Y10T29/49147 , Y10T29/49158
摘要： A transfer sheet includes an electrodeposited metal foil having a smooth surface and a rough surface attached to a heatproof flexible base sheet. Using such a transfer sheet, a circuit substrate is formed by etching the electrodeposited metal foil to form a circuit pattern, placing the transfer sheet into a cavity of a mold in such a manner that the rough surface of the circuit pattern faces an inside of the mold cavity, pouring a melting resin into the mold cavity to form a molded article, and peeling the transfer sheet from the molded article so that the circuit pattern remains on the resin base.
摘要翻译： 转印片包括具有光滑表面的电沉积金属箔和附着在耐热柔性基片上的粗糙表面。 使用这样的转印片，通过蚀刻电沉积金属箔形成电路图案形成电路基板，将转印片放置在模具的空腔中，使得电路图案的粗糙表面朝向 模具腔，将熔融树脂倒入模腔中以形成模制品，并将转印片从模制品上剥离，使得电路图案残留在树脂基底上。
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