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公开(公告)号：US20090038823A1
公开(公告)日：2009-02-12
申请号：US12186851
申请日：2008-08-06
IPC分类号： H01B5/00
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2924/0002 , H01R12/777 , H05K2201/10318 , Y02P70/613 , H01L2924/00
摘要： A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.
摘要翻译： 提供了一种具有引线引脚的布线基板，该引线引脚通过导电材料将导线焊接到布线基板上形成的电极焊盘而形成，并且在引脚中，端面侧与形成在引线板的一端的头部的电极焊盘相对 轴部分形成在锥形突出部分中，并且锥形突出部分的顶角也设置在110°至140°的角度范围内，并且导电材料插入在圆锥突起部分和电极焊盘之间，并且还 延伸到头部的平坦部分并到达轴部分的外表面，并且引脚接合到电极焊盘。
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公开(公告)号：US08153900B2
公开(公告)日：2012-04-10
申请号：US12200201
申请日：2008-08-28
IPC分类号： H01B5/00
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2224/32225 , H01L2924/15312 , H05K2201/10318 , Y02P70/613
摘要： A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.
摘要翻译： 具有引脚的布线基板是通过导电材料将引线焊接到形成在布线基板上的电极焊盘而形成的。 在引导销中，在与轴部的一端形成的头部的电极焊盘相对的端面侧形成有侧面形成为凹面的圆锥突起部。 在导电材料延伸到头部的背面侧超过头部的凸缘部分并到达引脚的轴部的状态下，将引脚接合到电极焊盘。
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公开(公告)号：US20090056992A1
公开(公告)日：2009-03-05
申请号：US12200201
申请日：2008-08-28
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2224/32225 , H01L2924/15312 , H05K2201/10318 , Y02P70/613
摘要： A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.
摘要翻译： 具有引脚的布线基板是通过导电材料将引线焊接到形成在布线基板上的电极焊盘而形成的。 在引导销中，在与轴部的一端形成的头部的电极焊盘相对的端面侧形成有侧面形成为凹面的圆锥突起部。 在导电材料延伸到头部的背面侧超过头部的凸缘部分并到达引脚的轴部的状态下，将引脚接合到电极焊盘。
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公开(公告)号：US07422449B2
公开(公告)日：2008-09-09
申请号：US11351028
申请日：2006-02-09
IPC分类号： H01R12/00
CPC分类号： H01R43/0256 , H01L2924/0002 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , Y02P70/613 , H01L2924/00
摘要： A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.
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公开(公告)号：US20080009155A1
公开(公告)日：2008-01-10
申请号：US11351028
申请日：2006-02-09
IPC分类号： H01R12/00
CPC分类号： H01R43/0256 , H01L2924/0002 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , Y02P70/613 , H01L2924/00
摘要： A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.
摘要翻译： 提供具有高可靠性的引线引脚的布线板。 当引线引脚连接到电极焊盘时，引线引脚连接到电极焊盘，而不会在导电剂中留下空隙，引脚的焊接强度提高。 当引线引脚连接到的接线板被再加热时，可以防止引脚从其正常位置倾斜或偏移。 在通过导电剂将引线引脚的头部附着在布线板上形成的电极焊盘而形成的引线引脚的引线板中，引线销具有切口形状，在圆盘的周缘部分形成切口形状 形状的头部。
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