Sputtering Apparatus
    1.
    发明申请
    Sputtering Apparatus 审中-公开
    溅射装置

    公开(公告)号:US20080308417A1

    公开(公告)日:2008-12-18

    申请号:US11886436

    申请日:2005-03-14

    IPC分类号: C23C14/00

    摘要: A sputtering apparatus includes target holders 4a and 4b for mounting targets thereon to constitute a cathode, a substrate holder 30 for holding a substrate 8, and magnets 51a and 51b for generating magnetic fields around the surface of the targets. A voltage is applied to backing plates 42 of the target holders 4a and 4b using a direct-current power supply 6 to generate plasma. An anode is made of an electrically-conductive material that is not molten by the retained, heated plasma with a high density. The anode 9 is connected to the ground electrical potential. At least a portion of the anode 9 is placed in or near the region where plasma is retained. During sputtering, electrons discharged from the target flow to the ground potential through the heated portion of the anode 9 being heated by the plasma, thereby keeping the direct-current power supply circuit closed. This can prevent electric-discharge abnormalities within the chamber with a simple configuration, without using an expensive pulsed power supply or a shielding plate.

    摘要翻译: 溅射装置包括用于在其上安装靶以构成阴极的靶保持器4a和4b,用于保持基板8的基板保持件30,以及用于在目标表面周围产生磁场的磁体51a和51b。 使用直流电源6向目标保持器4a和4b的背板42施加电压以产生等离子体。 阳极由导电材料制成,其不被保留的加热的等离子体以高密度熔化。 阳极9连接到接地电位。 阳极9的至少一部分放置在等离子体被保持的区域中或附近。 在溅射期间,通过由等离子体加热阳极9的被加热部分的从靶流出的电子流到接地电位,从而保持直流电源电路闭合。 这可以以简单的配置来防止室内的放电异常,而不使用昂贵的脉冲电源或屏蔽板。

    Mirrortron sputtering apparatus
    2.
    发明授权
    Mirrortron sputtering apparatus 失效
    Mirrortron溅射装置

    公开(公告)号:US06649036B2

    公开(公告)日:2003-11-18

    申请号:US09781102

    申请日:2001-02-08

    IPC分类号: C23C1435

    摘要: A mirrortron sputtering apparatus for sputtering on a substrate includes a vacuum chamber for placing therein a pair of targets spaced apart from each other with inner surfaces thereof facing each other and outer surfaces thereof positioned opposite to the inner surfaces, and magnets respectively disposed closer to the outer surfaces of the targets for forming a magnetic field between said pair of targets. The magnetic field has a magnetic field distribution with a peripheral region having a high magnetic flux density and a center region having a low magnetic flux density. In this arrangement, the substrate is set alongside a space between the pair of targets as facing said magnetic field.

    摘要翻译: 用于在基板上溅射的金刚石溅射装置包括:真空室,用于在其中放置一对彼此间隔的目标,其内表面彼此面对,并且其外表面与内表面相对,并且分别设置在更靠近 所述靶的外表面用于在所述一对靶之间形成磁场。 磁场具有具有磁通密度高的周边区域和具有低磁通密度的中心区域的磁场分布。 在这种布置中,将衬底与面对所述磁场的一对靶之间的空间设置。