Abstract:
In one embodiment, the present invention includes a method for forming a sacrificial oxide layer on a base layer of a microelectromechanical systems (MEMS) probe, patterning the sacrificial oxide layer to provide a first trench pattern having a substantially rectangular form and a second trench pattern having a substantially rectangular portion and a lateral portion extending from the substantially rectangular portion, and depositing a conductive layer on the patterned sacrificial oxide layer to fill the first and second trench patterns to form a support structure for the MEMS probe and a cantilever portion of the MEMS probe. Other embodiments are described and claimed.
Abstract:
An actuator comprises a connection section having one end rotatably connected to a connection point (C1) of a fixed section and the other end rotatably connected to a connection point (C2) of a moving section, a connection section having one end rotatably connected to a connection point (C3) of the fixed section and the other end rotatably connected to a connection point (C4) of the moving sections a comb-teeth electrode having the root section connected to a comb-teeth base point (B1) and the fore-end section extending along the turning path, and a comb-teeth electrode having the root section connected to the fixed section and the other section extending along the curve of the comb-teeth electrode and opposed to the comb-teeth electrode with a predetermined gap.
Abstract:
An actuating mechanism includes a scanner chip having a scan table mounting cavity, and a bracket moveably positioned in the scan table mounting cavity. A scan table is moveably positioned in the bracket. The bracket has a first mass and the scan table has a second mass. A first coil and frame collectively define a third mass and a second coil and frame collectively define a fourth mass. A first pivoting element is connected to the first coil and the scan table. The first pivoting element is pivotally supported about a first pivot point and connected though an asymmetrical leverage connection to the first coil and the scan table. A second pivoting element is connected to the second coil and the scan table. The second pivoting element is pivotally supported about a second pivot point and connected through a symmetric leverage connection to the second coil and the scan table.
Abstract:
A method of fabricating a micro actuator is provided including a media stage having a media loading surface and a coil for driving the media stage, formed on the opposite surface of the media stage to the media loading surface. The method includes forming a groove on a first surface of a first substrate, forming a coil on a first surface of a second substrate, bonding the first surface of the first substrate to the first surface of the second substrate, and forming the media loading surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.
Abstract:
Forming an actuating mechanism for a micro-scanning device includes forming a scanner chip having a scan table mounting cavity, first and second coil mounting cavities and first and second pivoting element mounting cavities, positioning a bracket in the scan table mounting cavity, and positioning a scan table in the bracket. A first frame is mounted in the first coil mounting cavity, and a second frame is mounted in the second coil mounting cavity. A first pivoting element is positioned in the first pivoting element mounting cavity. The first pivoting element includes an asymmetrical leverage connection to the first coil and the scan table. In addition, a second pivoting element is connected to the second coil and the scan table, and positioned in the second pivoting element mounting cavity. The second pivoting element includes a symmetric leverage connection or an asymmetric leverage connection to the second coil and the scan table.
Abstract:
A MEMS platform with four actuators and four corresponding actuation electrodes. Movement of the platform in the x-y lateral plane is controlled by voltages applied to the four actuation electrodes. Other embodiments are described and claimed.
Abstract:
The hinge (13) should preferably be formed to have a higher resistance than ever against the pivoting of the mirror body (12) to effectively prevent the hinge (13) from being damaged. By adopting a suitable one of a variety of production steps as necessary, the hinge (13) can be formed more finely and with a higher precision and thus the micro mirror unit can be produced more easily in a shorter time. To this end, the hinge (13) is formed from a different material, such as SiNx, from the mirror substrate material from which the frame (11) and mirror body (12) are formed.
Abstract translation:优选地,铰链(13)形成为具有比以往更高的抗反射镜主体(12)的枢转的阻力,以有效地防止铰链(13)被损坏。 通过根据需要采用各种生产步骤中的合适的一种,铰链(13)可以更精细地形成并且具有更高的精度,从而可以在更短的时间内更容易地制造微反射镜单元。 为此,铰链(13)由形成框架(11)和反射镜主体(12)的反射镜基板材料由不同的材料(例如SiN x x)形成。
Abstract:
A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.
Abstract:
The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.
Abstract:
A package to receive a memory device including an electromagnetic motor comprises a body having a top surface and a bottom surface. Conductive leads extend through the body so that the conductive leads are at least partially exposed within the package. A base is connectable with the bottom surface of the body, and a lid is connectable with the top surface of the body. The base and the lid have substantially matched thermal expansion characteristics and provide magnetic flux return paths for the electromagnetic motor.