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    Semi-sacrificial mold for diamond structures
    2.
    发明授权
    Semi-sacrificial mold for diamond structures 失效
    用于金刚石结构的半牺牲模具

    公开(公告)号：US07598107B1

    公开(公告)日：2009-10-06

    申请号：US11234066

    申请日：2005-09-23

    Applicant: Hongbing Liu ,  Victor B. Kley

    Inventor： Hongbing Liu ,  Victor B. Kley

    IPC: H01L21/00

    CPC classification number: B81C99/0085 ,  B81B2201/12 ,  G01Q60/38 ,  G01Q70/14

    Abstract: A patterned structure forms a portion of the mold for a diamond molded structure but is separable from the mold by the same processes that release the diamond part. The mold portion may itself be a component in a MEMS or NEMS structure or device or the precursor to such a structure or device. The mold portion may be made from sapphire or silicon carbide. The mold portion may be coated and polished to obtain an optically smooth surface over the diamond mold inside pit. The coating may be formed from one or more of silicon carbide, PTFE, silicon nitride, silicon dioxide, sapphire, a metal, a plastic, and an epoxy.

    Abstract translation: 图案化结构形成用于金刚石模制结构的模具的一部分，但是通过与释放金刚石部件相同的工艺可与模具分离。 模具部分本身可以是MEMS或NEMS结构或装置中的组件或这种结构或装置的前体。 模具部分可以由蓝宝石或碳化硅制成。 模具部分可以被涂覆和抛光以在凹坑内的金刚石模具上获得光学平滑的表面。 涂层可以由碳化硅，PTFE，氮化硅，二氧化硅，蓝宝石，金属，塑料和环氧树脂中的一种或多种形成。

    Cantilever probe and scanning type probe microscope utilizing the cantilever probe
    5.
    发明授权
    Cantilever probe and scanning type probe microscope utilizing the cantilever probe 失效
    悬臂式探头和扫描型探针显微镜利用悬臂式探头

    公开(公告)号：US5992225A

    公开(公告)日：1999-11-30

    申请号：US987734

    申请日：1997-12-09

    Applicant: Yoshiharu Shirakawabe ,  Nobuhiro Shimizu ,  Hiroshi Takahashi

    Inventor： Yoshiharu Shirakawabe ,  Nobuhiro Shimizu ,  Hiroshi Takahashi

    IPC: G01B21/30 ,  B81C1/00 ,  G01B7/34 ,  G01N27/00 ,  G01N37/00 ,  G01Q60/38

    CPC classification number: G01Q60/38 ,  B81C1/0015 ,  B82Y35/00 ,  B81B2201/12 ,  B81B2203/019 ,  Y10S977/873

    Abstract: A cantilever probe for scanning a sample surface comprises a cantilever having a free end and a fixed end. A first support section is disposed at the free end and extends along a first plane. A probe is formed on the first support section for scanning movement relative to the sample surface. A second support section is disposed at the fixed end and extends along a second plane different from the first plane. A beam section interconnects the first support member and the second support member to one another and extends along a third plane different from the first and second planes.

    Abstract translation: 用于扫描样品表面的悬臂探头包括具有自由端和固定端的悬臂。 第一支撑部分设置在自由端并沿第一平面延伸。 探针形成在第一支撑部分上，用于扫描相对于样品表面的运动。 第二支撑部分设置在固定端并沿着与第一平面不同的第二平面延伸。 梁部分将第一支撑构件和第二支撑构件彼此互连并且沿着不同于第一和第二平面的第三平面延伸。

    Transferable probe tips
    7.
    发明授权
    Transferable probe tips 有权
    可转移探针尖端

    公开(公告)号：US09200883B2

    公开(公告)日：2015-12-01

    申请号：US13101253

    申请日：2011-05-05

    Applicant: Paul S. Andry ,  Bing Dang ,  Steven L. Wright

    Inventor： Paul S. Andry ,  Bing Dang ,  Steven L. Wright

    IPC: G01N27/84 ,  G01R33/12 ,  G01R31/26 ,  H01L21/66 ,  H01L21/44 ,  G01B5/28 ,  G03F7/00 ,  G01R1/073 ,  G01R3/00 ,  G01Q70/14 ,  G01R1/067 ,  G01Q70/16 ,  G01Q40/02

    CPC classification number: G01B5/28 ,  B81B2201/12 ,  B81C3/001 ,  B81C2201/0194 ,  G01Q40/02 ,  G01Q70/14 ,  G01Q70/16 ,  G01R1/067 ,  G01R1/06738 ,  G01R1/07378 ,  G01R3/00 ,  G03F7/00

    Abstract: Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.

    Abstract translation: 本发明提供了包括金属探针，覆盖金属探针的一部分的分层和可接合的探针尖端，以及接合合金，其中接合合金在未被分层的被覆层的探针的一部分处接触金属探针。 此外，提供了用于产生可转移探针尖端的技术，包括蚀刻处理器衬底以形成一个或多个通孔阵列，在每个通孔阵列中沉积分层，在每个通孔阵列中沉积一个或多个金属以形成探针尖端结构， 以及在未被分层层覆盖的探针尖端结构的一部分上沉积接合合金。 此外，提供了用于传送可转移的探针尖端的技术，包括从探针尖端结构去除处理器基底，以及通过将探针尖端结构连接到目标探针头基底的倒装芯片来传送探针尖端结构。

    CARBON NANOTUBE BASED MICRO-TIP STRUCTURE AND METHOD FOR MAKING THE SAME
    9.
    发明申请
    CARBON NANOTUBE BASED MICRO-TIP STRUCTURE AND METHOD FOR MAKING THE SAME 有权
    基于碳纳米管的微型结构及其制备方法

    公开(公告)号：US20130220534A1

    公开(公告)日：2013-08-29

    申请号：US13592763

    申请日：2012-08-23

    Applicant: YANG WEI ,  SHOU-SHAN FAN

    Inventor： YANG WEI ,  SHOU-SHAN FAN

    IPC: B29C59/16 ,  B82Y40/00

    CPC classification number: B81C1/0015 ,  B81B2201/12 ,  G01Q70/12 ,  H01J1/304 ,  H01J9/025 ,  H01J37/073 ,  H01J2201/30469 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1077 ,  Y10T156/1082

    Abstract: A method for making a carbon nanotube micro-tip structure is disclosed. A carbon nanotube film structure and an insulting substrate are provided. The insulating substrate includes a surface. At least one strip-shaped recess is defined at the surface. The carbon nanotube film structure is covered on the surface of the insulating substrate, and has a suspended portion covered on the at least one strip-shaped recess. The suspended portion of the carbon nanotube film structure is laser etched, to define a first hollow pattern in the suspended portion and form a patterned carbon nanotube film structure according to the first hollow pattern. The patterned carbon nanotube film structure includes two strip-shaped arms. The two strip-shaped arms are joined at one end to form a tip portion. The tip portion is suspended above the strip-shaped recess.

    Abstract translation: 公开了一种制造碳纳米管微尖端结构的方法。 提供碳纳米管膜结构和绝缘基板。 绝缘基板包括表面。 在表面上限定至少一个条状凹槽。 碳纳米管膜结构覆盖在绝缘基板的表面上，并且具有覆盖在至少一个带状凹部上的悬置部分。 激光蚀刻碳纳米管膜结构的悬浮部分，以在悬浮部分中限定第一中空图案，并根据第一中空图案形成图案化的碳纳米管薄膜结构。 图案化碳纳米管薄膜结构包括两个带状臂。 两个带状臂在一端连接以形成尖端部分。 尖端部分悬挂在条状凹槽的上方。

    Forming a cantilever assembly for vertical and lateral movement
    10.
    发明授权
    Forming a cantilever assembly for vertical and lateral movement 有权
    形成垂直和横向运动的悬臂组件

    公开(公告)号：US07687297B2

    公开(公告)日：2010-03-30

    申请号：US11824465

    申请日：2007-06-29

    Applicant: John Heck ,  Tsung-Kuan Allen Chou

    Inventor： John Heck ,  Tsung-Kuan Allen Chou

    IPC: H01L21/00

    CPC classification number: B81C1/00246 ,  B81B2201/07 ,  B81B2201/11 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C2203/0735 ,  B82Y10/00 ,  G11B9/1436

    Abstract: In one embodiment, the present invention includes a method for forming a sacrificial oxide layer on a base layer of a microelectromechanical systems (MEMS) probe, patterning the sacrificial oxide layer to provide a first trench pattern having a substantially rectangular form and a second trench pattern having a substantially rectangular portion and a lateral portion extending from the substantially rectangular portion, and depositing a conductive layer on the patterned sacrificial oxide layer to fill the first and second trench patterns to form a support structure for the MEMS probe and a cantilever portion of the MEMS probe. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，本发明包括在微机电系统（MEMS）探针的基底层上形成牺牲氧化物层的方法，图案化牺牲氧化物层以提供具有基本矩形形状的第一沟槽图案和第二沟槽图案 具有基本上矩形的部分和从所述大致矩形部分延伸的横向部分，以及在所述图案化的牺牲氧化物层上沉积导电层以填充所述第一和第二沟槽图案以形成用于所述MEMS探针的支撑结构， MEMS探针。 描述和要求保护其他实施例。

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