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    Method of making IC card
    2.
    发明授权
    Method of making IC card 失效
    IC卡制作方法

    公开(公告)号：US5520863A

    公开(公告)日：1996-05-28

    申请号：US348487

    申请日：1994-12-02

    申请人： Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    发明人： Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K3/28 ,  B29C44/06 ,  B29C44/12

    CPC分类号： H05K3/284 ,  G06K19/077 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S425/812

    摘要： A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

    摘要翻译： 一种用于制造IC卡的方法，包括用包含发泡树脂的混合物填充密闭空间，所述混合物尚未发泡，所述空间被具有内边缘上的切口部分的框架和至少一个通孔 在框架的内部和外部之间沿横向方向穿过框架，电路板，功能部件安装在该电路板上，并且边缘装配到框架的一个切口部分，使得电路板的表面 其中功能部件被安装在其上，框架和电路板形成基本上平坦的外表面，以及薄板，其边缘装配到框架的另一个切口部分，薄板与电路板相对， 框架和薄板形成基本平坦的外表面; 在预定温度下将混合物发泡预定时间，由此用泡沫树脂填充密闭空间，从而使发泡树脂具有机械强度的结构件，将框架，电路板和薄板模制成一体; 并从框架中的通孔中除去多余的发泡树脂。