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    Method of making IC card
    1.
    发明授权
    Method of making IC card 失效
    IC卡制作方法

    公开(公告)号：US5520863A

    公开(公告)日：1996-05-28

    申请号：US348487

    申请日：1994-12-02

    申请人： Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    发明人： Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K3/28 ,  B29C44/06 ,  B29C44/12

    CPC分类号： H05K3/284 ,  G06K19/077 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S425/812

    摘要： A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

    摘要翻译： 一种用于制造IC卡的方法，包括用包含发泡树脂的混合物填充密闭空间，所述混合物尚未发泡，所述空间被具有内边缘上的切口部分的框架和至少一个通孔 在框架的内部和外部之间沿横向方向穿过框架，电路板，功能部件安装在该电路板上，并且边缘装配到框架的一个切口部分，使得电路板的表面 其中功能部件被安装在其上，框架和电路板形成基本上平坦的外表面，以及薄板，其边缘装配到框架的另一个切口部分，薄板与电路板相对， 框架和薄板形成基本平坦的外表面; 在预定温度下将混合物发泡预定时间，由此用泡沫树脂填充密闭空间，从而使发泡树脂具有机械强度的结构件，将框架，电路板和薄板模制成一体; 并从框架中的通孔中除去多余的发泡树脂。

    Method of manufacturing IC card
    3.
    发明授权
    Method of manufacturing IC card 失效
    IC卡制造方法

    公开(公告)号：US5346576A

    公开(公告)日：1994-09-13

    申请号：US85054

    申请日：1993-07-02

    申请人： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    发明人： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L29/06 ,  B32B31/00 ,  B29C65/02

    CPC分类号： G06K19/07745 ,  H01L29/0657 ,  H01L2924/0002 ,  Y10S428/915 ,  Y10S428/916 ,  Y10T428/24322 ,  Y10T428/24826 ,  Y10T428/24917

    摘要： In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

    摘要翻译： 在IC卡及其制造方法中，在放置IC模块的开口附近的芯层之间施加粘合剂。 当施加热和压力时，保持在粘合剂层之间的芯片层可以容易地变形。 因此，填充卡片基板和IC模块之间形成的间隙。 此外，IC模块的间隙比常规成形的开口在IC模块的拐角处更窄。 结果，防止一体成型后IC模块的拐角处的间隙。 因此，可以在成型时可靠地填充IC模块与卡片基板之间的间隙。

    IC card
    4.
    发明授权
    IC card 失效
    IC卡

    公开(公告)号：US5250341A

    公开(公告)日：1993-10-05

    申请号：US648511

    申请日：1991-01-30

    申请人： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    发明人： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L29/06 ,  B32B3/00

    CPC分类号： G06K19/07745 ,  H01L29/0657 ,  H01L2924/0002 ,  Y10S428/915 ,  Y10S428/916 ,  Y10T428/24322 ,  Y10T428/24826 ,  Y10T428/24917

    摘要： In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

    摘要翻译： 在IC卡及其制造方法中，在放置IC模块的开口附近的芯层之间施加粘合剂。 当施加热和压力时，保持在粘合剂层之间的芯片层可以容易地变形。 因此，填充卡片基板和IC模块之间形成的间隙。 此外，IC模块的间隙比常规成形的开口在IC模块的拐角处更窄。 结果，防止一体成型后IC模块的拐角处的间隙。 因此，可以在成型时可靠地填充IC模块与卡片基板之间的间隙。

    Portable semiconductor device with resin
    5.
    发明授权
    Portable semiconductor device with resin 失效
    带树脂的便携式半导体器件

    公开(公告)号：US5461256A

    公开(公告)日：1995-10-24

    申请号：US145224

    申请日：1993-11-03

    申请人： Akira Yamada ,  Fumiaki Baba ,  Syojiro Kodai ,  Tsuguo Kurisu ,  Makoto Kobayashi

    发明人： Akira Yamada ,  Fumiaki Baba ,  Syojiro Kodai ,  Tsuguo Kurisu ,  Makoto Kobayashi

    IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/28 ,  H05K3/28 ,  G06K19/00

    CPC分类号： G06K19/07745 ,  H01L2924/0002 ,  H05K3/284

    摘要： At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.

    摘要翻译： 便携式半导体装置的两部分容器的至少一部分具有电子部分容纳部分，设置在容器的周边部分处的用于容纳过量的发泡树脂的发泡树脂容纳部分和用于耦合的联接槽 电子部件容纳部分到发泡树脂容纳部分。 由于电子部件和电路板完全嵌入设备中，因此可以通过简单的工艺制造出具有优异的耐环境性的半导体器件。

    Substrate processing apparatus
    6.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US09455125B2

    公开(公告)日：2016-09-27

    申请号：US13070115

    申请日：2011-03-23

    申请人： Akihiro Yoshimura ,  Tetsuji Sato ,  Masato Horiguchi ,  Nobuhiro Wada ,  Makoto Kobayashi ,  Hiroshi Tsujimoto ,  Jun Tamura ,  Mamoru Naoi

    发明人： Akihiro Yoshimura ,  Tetsuji Sato ,  Masato Horiguchi ,  Nobuhiro Wada ,  Makoto Kobayashi ,  Hiroshi Tsujimoto ,  Jun Tamura ,  Mamoru Naoi

    IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32

    CPC分类号： H01J37/32091 ,  H01J37/32568

    摘要： Disclosed is a substrate processing apparatus capable of suppressing generation of plasma in the space between a moving electrode and an end wall at one side of a cylindrical chamber. The substrate processing apparatus includes a cylindrical chamber to receive a wafer, a shower head movable along a central axis of the chamber inside the chamber, a susceptor opposing the shower head in the chamber, and a flexible bellows connecting the shower head to a cover of the chamber, wherein a high frequency power is applied to a processing space presented between the shower head and the susceptor, processing gas is introduced into the processing space, the shower head and the side wall of the chamber are non-contact to each other, and a bypass member is installed electrically connecting the shower head and the cover or the side wall of the chamber.

    摘要翻译： 公开了一种能够抑制在圆筒形室的一侧的移动电极与端壁之间的空间中产生等离子体的基板处理装置。 基板处理装置包括用于容纳晶片的圆柱形室，可沿着室内的室的中心轴线移动的喷头，与腔室中的淋浴喷头相对的基座，以及柔性波纹管，其将淋浴头连接到 所述室，其中向所述淋浴喷头和所述基座之间呈现的处理空间施加高频功率，将处理气体引入所述处理空间中，所述淋浴喷头和所述室的侧壁彼此不接触， 并且旁路部件被安装成电连接淋浴头和盖子或室的侧壁。

    Heat treatment furnace and heat treatment apparatus
    8.
    发明授权
    Heat treatment furnace and heat treatment apparatus 有权
    热处理炉和热处理设备

    公开(公告)号：US08957352B2

    公开(公告)日：2015-02-17

    申请号：US13533291

    申请日：2012-06-26

    申请人： Makoto Kobayashi

    发明人： Makoto Kobayashi

    IPC分类号： H05B3/06 ,  H01L21/67 ,  F27D5/00

    CPC分类号： H01L21/67103 ,  H01L21/67109

    摘要： Provided is a heat treatment furnace, which includes a processing vessel configured to accommodate at least one object to be processed, a heat insulating member configured to cover a periphery of the processing vessel, and a heating unit configured to be arranged along an inner peripheral surface of the heat insulating member. The heat insulating member includes an inner heat insulating member and an outer heat insulating member formed independently of the inner heat insulating member. The outer heat insulating member contains a finely-powdered compressed silica material, and at least an outer surface thereof is covered with an anti-scattering member configured to prevent the finely-powdered compressed silica material from being scattered.

    摘要翻译： 本发明提供一种热处理炉，其包括配置成容纳至少一个待处理物体的处理容器，构造成覆盖处理容器周围的绝热构件和构造成沿着内周面 的绝热构件。 绝热构件包括内绝热构件和独立于内绝热构件形成的外绝热构件。 外绝热构件包含细粉状压缩二氧化硅材料，并且至少其外表面覆盖有防止粉碎的压缩二氧化硅材料分散的抗散射构件。

    Overhead Transport Vehicle
    10.
    发明申请
    Overhead Transport Vehicle 有权
    架空运输车辆

    公开(公告)号：US20140047995A1

    公开(公告)日：2014-02-20

    申请号：US13985542

    申请日：2011-12-08

    申请人： Makoto Kobayashi

    发明人： Makoto Kobayashi

    IPC分类号： B61B3/00

    CPC分类号： B61B3/00 ,  H01L21/67733

    摘要： An overhead transport vehicle comprises a travelling unit that travels on a rail, a conveying unit that moves and conveys an article and a swing inhibiting member that moves between a pushing position and a retracting position. The swing inhibiting members includes a pushing member that pushes a side surface of the article, lever members that support the pushing member at a first end side and are pivotally supported by the conveying unit at a second end side, and a biasing member that biases the pushing member toward the article. The pushing member includes a main body member pivotally supported by the lever members, slide members slidably supported by a main body member, and elastic bodies arranged between the main body member and the slide member that slide elastically the slide member.

    摘要翻译： 架空运输车辆包括在轨道上行进的行进单元，移动和运送物品的输送单元和在推动位置和缩回位置之间移动的摆动禁止构件。 摆动抑制构件包括：推动构件的侧面的推动构件，在第一端侧支撑推动构件的杆构件，并且在第二端侧由输送单元枢转地支撑;以及偏压构件， 推动会员朝向文章。 推动构件包括由杠杆构件可枢转地支撑的主体构件，由主体构件可滑动地支撑的滑动构件，以及布置在主体构件和滑动构件之间弹性滑动滑动构件的弹性体。