摘要:
A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a high resistivity layer, an assistant electrode layer, and a transparent conductive layer. The metal layer is formed on the substrate, and comprises a plurality of p-type electrode units separated from each other. The p-type semiconductor layer is formed on the metal layer. The n-type semiconductor is formed on the p-type semiconductor layer, thereby forming a p-n junction. The high resistivity layer is formed on the n-type semiconductor layer. The assistant electrode layer is formed on the high resistivity layer and the p-type electrode units. The transparent conductive layer is formed on the assistant electrode layer, the high resistivity layer and the p-type electrode units. Accordingly, at least one cell is formed on each of the p-type electrode units. The assistant electrode layer and the transparent conductive layer are connected to the cells in series.
摘要:
A full-color OLED display panel comprises a full-color organic light-emitting device and a colored filter device stacked on the light-exit surface of the full-color organic light-emitting device. The full-color organic light-emitting device comprises a first electrode, a plurality of second electrodes, a first light-emitting layer sandwiched between the first electrode and a portion of the second electrodes, and a second light-emitting layer sandwiched between the first electrode and portions of the second electrodes and the first light-emitting layer. The colored filter device comprises a substrate, and a plurality of first color filter portions, a plurality of second color filter portions and a plurality of third color filter portions disposed on the surface of the substrate. The first color filter portions allow a first color light emitted from the first light-emitting layer to pass through, and the second color filter portions and the third color filter portions each allow rays with different wavelengths in a second color light emitted from the second light-emitting layer to pass through.
摘要:
A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer.
摘要:
A photovoltaic cell structure includes a substrate, a metal layer, a high resistivity layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The metal layer may include molybdenum and be formed on the substrate to be a back contact metal layer of the cell. The high resistivity layer (e.g., V2O5) is formed on the metal layer. The p-type semiconductor layer is formed on the high resistivity layer and may include compound of CIGS or CIS. The n-type semiconductor layer (e.g., CdS) is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer.
摘要翻译:光伏电池结构包括基板,金属层,高电阻率层,p型半导体层,n型半导体层和透明导电层。 金属层可以包括钼,并且在基板上形成为电池的背接触金属层。 在金属层上形成高电阻率层(例如,V 2 O 5)。 p型半导体层形成在高电阻率层上,可以包括CIGS或CIS的化合物。 在p型半导体层上形成n型半导体层(例如CdS),由此形成p-n结。 透明导电层形成在n型半导体层上。
摘要:
A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The substrate has a rough surface. The metal layer may include molybdenum and be formed on the rough surface. The p-type semiconductor layer is formed on the metal layer and may include CIGSS, CIGS, CIS, or compound of two or more of copper, selenium, sulfur. The n-type semiconductor layer is formed on the p-type semiconductor layer thereby forming a rough p-n junction surface. The n-type semiconductor layer may include CdS. The transparent conductive layer is formed on the n-type semiconductor layer. In an embodiment, the roughness Ra of the rough surface is between 0.01 to 100 μm.